데이터 시트
CD4504B-MIL
- Independence of power-supply sequence considerations - VCC can exceed VDD; input signals can exceed both VCC and VDD
- Up and down level-shifting capability
- Shiftable input threshold for either CMOS or TTL compatibility
- Standardized symmetrical output characteristics
- 100% tested for quiescent current @ 20 V
- Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
- 5V, 10 V, and 15 V parametric ratings
- Meets all requirements of JEDEC Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
Data sheet acquired from Harris Semiconductor.
CD4504B hex voltage level-shifter consists of six circuits which shift input signals from the VCC logic level to the VDD logic level. To shift TTL signals to CMOS logic levels, the SELECT input is at the VCC HIGH logic state. When the SELECT input is a LOW logic state, each circuit translates signals from one CMOS level to another.
The CD4504B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and MT suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
비교 대상 장치와 유사한 기능
기술 자료
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
11개 모두 보기 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CD4504B TYPES datasheet (Rev. D) | 2004/11/09 | |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 | |
Application brief | Leveraging TXH for High Voltage Level Shifting | PDF | HTML | 2023/07/28 | |
Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021/04/15 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003/11/14 | ||
Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 2001/12/03 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치