DRV8816
- H-Bridge Motor Driver Individual
- Drives a DC Motor or Other Loads
- Low RDS(on) MOSFETs (0.4-Ω TYP)
- Low-Power Sleep Mode
- 100% PWM Supported
- 8- to 38-V Operating Supply Voltage Range
- Thermally Enhanced Surface Mount Package
- Configurable Overcurrent Limit
- Protection Features
- VBB Undervoltage Lockout (UVLO)
- Charge Pump Undervoltage (CPUV)
- Overcurrent Protection (OCP)
- Short-to-Supply Protection (STS)
- Short-to-Ground Protection (STG)
- Overtemperature Warning (OTW)
- Overtemperature Shutdown (OTS)
- Fault Condition Indication Pin (nFAULT)
The DRV8816 provides a versatile power driver solution with two independent ½-H bridge drivers. The device can drive one brushed DC motor or one winding of a stepper motor, as well as other devices like solenoids. A simple INx/ENx interface allows easy interfacing to controller circuits.
The output stages use N-channel power MOSFETs configured as ½-H-bridges. The DRV8816 is capable of peak output currents up to ±2.8 A and operating voltages up to 38 V. An internal charge pump generates needed gate drive voltages.
A low-power sleep mode is provided which shuts down internal circuitry to achieve very-low quiescent current draw. This sleep mode can be set using a dedicated nSLEEP pin.
Internal protection functions are provided for UVLO, charge pump fault, OCP, short-to-supply protection, short-to-ground protection, overtemperature warning, and overtemperature shutdown. Fault conditions are indicated through a nFAULT pin
The DRV8816 is packaged in a 16-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br)
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 | |
|---|---|---|---|---|---|---|
| * | 데이터 시트 | DRV8816 DMOS Dual 1/2-H-Bridge Motor Drivers datasheet (Rev. C) | PDF | HTML | 2016. 4. 12 | ||
| 애플리케이션 노트 | Best Practices for Board Layout of Motor Drivers (Rev. B) | PDF | HTML | 2021. 10. 14 | |||
| 애플리케이션 노트 | L1 and L2 EV Charger Electric Vehicle Service Equipment Design Considerations (Rev. B) | 2021. 6. 9 | ||||
| 애플리케이션 노트 | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018. 7. 6 | ||||
| Application brief | PowerPAD™ Made Easy (Rev. B) | 2004. 5. 12 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| HTSSOP (PWP) | 16 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.