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DSP type 1 C64x DSP (max) (MHz) 594 CPU 32-/64-bit Operating system DSP/BIOS, Linux, ThreadX, Ultron, Windows Embedded CE Ethernet MAC 10/100 Rating Military Operating temperature range (°C) -40 to 105
DSP type 1 C64x DSP (max) (MHz) 594 CPU 32-/64-bit Operating system DSP/BIOS, Linux, ThreadX, Ultron, Windows Embedded CE Ethernet MAC 10/100 Rating Military Operating temperature range (°C) -40 to 105
NFBGA (ZWT) 361 256 mm² 16 x 16
  • High-Performance Digital Media SoC
    • 594-MHz C64x+™ Clock Rates
    • 297-MHz ARM926EJ-S™ Clock Rates
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 4752 C64x+ MIPS
    • Fully Software-Compatible With C64x/ARM9™
    • Extended Temperature Devices Available
  • Advanced Very-Long-Instruction-Word (VLIW)
    TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit,
        Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies
        (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit
        Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and
        Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 80K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 64K-Byte L2 Unified Mapped RAM/Cache
      (Flexible RAM/Cache Allocation)
  • ARM926EJ-S Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode)
      Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 16K-Byte RAM
    • 8K-Byte ROM
  • Embedded Trace Buffer™ (ETB11™) With 4KB
    Memory for ARM9 Debug
  • Endianness: Little Endian for ARM and DSP
  • Video Processing Subsystem
    • Front End Provides:
      • CCD and CMOS Imager Interface
      • BT.601/BT.656 Digital YCbCr 4:2:2
        (8-/16-Bit) Interface
      • Preview Engine for Real-Time Image Processing
      • Glueless Interface to Common Video Decoders
      • Histogram Module
      • Auto-Exposure, Auto-white Balance and Auto-Focus Module
      • Resize Endine
        • Resize Images From 1/4x to 4x
        • Separate Horizontal/Vertical Control
    • Back End Provides:
      • Hardware On-Screen Display (OSD)
      • Four 54_MHz DACs for a Combination of
        • Composite NTSC/PAL Video
        • Luma/Chroma Separate Video (S-Video)
        • Component (YPbPR or RGB) Video (Progressive)
      • Digital Output
        • 8-/16-bit YUV or up to 24-Bit RGB
        • HD Resolution
        • Up to 2 Video Windows
  • External Memory Interfaces (EMIFs)
    • 32-Bit DDR2 SDRAM Memory Controller With
      256M-Byte Address Space (1.8-V I/O)
    • Asynchronous 16-Bit Wide EMIF (EMIFA) With 128M-Byte
      Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Flash Card Interfaces
    • Multimedia Card (MMC)/Secure Digital (SD)
      with Secure Data I/O (SDIO)
    • Compact Flash Controller With True IDE Mode
    • SmartMedia
  • Enhanced Direct-Memory-Access (EDMA)
    Controller (64 Independent Channels)
  • Two 64-Bit General-Purpose Timers (Each
    Configurable as Two 32-Bit Timers)
  • One 64-Bit Watch Dog Timer
  • Three UARTs (One with RTS and CTS Flow Control)
  • One Serial Peripheral Interface (SPI) With Two Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Audio Serial Port (ASP)
    • I2S
    • AC97 Audio Codec Interface
    • Standard Voice Codec Interface (AIC12)
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Media Independent Interface (MII)
  • VLYNQ™ Interface (FPGA Interface)
  • Host Port Interface (HPI) with 16-Bit Multiplexed
    Address/Data
  • USB Port With Integrated 2.0 PHY
    • USB 2.0 High-/Full-Speed (480-Mbps) Client
    • USB 2.0 High-/Full-/Low-Speed Host (Mini-Host,
      Supporting One External Device)
  • Three Pulse Width Modulator (PWM) Outputs
  • On-Chip ARM ROM Bootloader (RBL) to Boot
    From NAND Flash or UART
  • ATA/ATAPI I/F (ATA/ATAPI-6 Specification)
  • Individual Power-Saving Modes for ARM/DSP
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • Up to 71 General-Purpose I/O (GPIO) Pins
    (Multiplexed With Other Device Functions)
  • 361-Pin Pb-Free BGA Package (ZWT Suffix),
    0.8-mm Ball Pitch
  • 0.09-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2-V Internal
  • Applications:
    • Digital Media
    • Networked Media Encode/Decode
    • Video Imaging
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature
      Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

(1) Additional temperature ranges are available - contact factory

All trademarks are the property of their respective owners.

  • High-Performance Digital Media SoC
    • 594-MHz C64x+™ Clock Rates
    • 297-MHz ARM926EJ-S™ Clock Rates
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 4752 C64x+ MIPS
    • Fully Software-Compatible With C64x/ARM9™
    • Extended Temperature Devices Available
  • Advanced Very-Long-Instruction-Word (VLIW)
    TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit,
        Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies
        (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit
        Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and
        Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 80K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 64K-Byte L2 Unified Mapped RAM/Cache
      (Flexible RAM/Cache Allocation)
  • ARM926EJ-S Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode)
      Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 16K-Byte RAM
    • 8K-Byte ROM
  • Embedded Trace Buffer™ (ETB11™) With 4KB
    Memory for ARM9 Debug
  • Endianness: Little Endian for ARM and DSP
  • Video Processing Subsystem
    • Front End Provides:
      • CCD and CMOS Imager Interface
      • BT.601/BT.656 Digital YCbCr 4:2:2
        (8-/16-Bit) Interface
      • Preview Engine for Real-Time Image Processing
      • Glueless Interface to Common Video Decoders
      • Histogram Module
      • Auto-Exposure, Auto-white Balance and Auto-Focus Module
      • Resize Endine
        • Resize Images From 1/4x to 4x
        • Separate Horizontal/Vertical Control
    • Back End Provides:
      • Hardware On-Screen Display (OSD)
      • Four 54_MHz DACs for a Combination of
        • Composite NTSC/PAL Video
        • Luma/Chroma Separate Video (S-Video)
        • Component (YPbPR or RGB) Video (Progressive)
      • Digital Output
        • 8-/16-bit YUV or up to 24-Bit RGB
        • HD Resolution
        • Up to 2 Video Windows
  • External Memory Interfaces (EMIFs)
    • 32-Bit DDR2 SDRAM Memory Controller With
      256M-Byte Address Space (1.8-V I/O)
    • Asynchronous 16-Bit Wide EMIF (EMIFA) With 128M-Byte
      Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Flash Card Interfaces
    • Multimedia Card (MMC)/Secure Digital (SD)
      with Secure Data I/O (SDIO)
    • Compact Flash Controller With True IDE Mode
    • SmartMedia
  • Enhanced Direct-Memory-Access (EDMA)
    Controller (64 Independent Channels)
  • Two 64-Bit General-Purpose Timers (Each
    Configurable as Two 32-Bit Timers)
  • One 64-Bit Watch Dog Timer
  • Three UARTs (One with RTS and CTS Flow Control)
  • One Serial Peripheral Interface (SPI) With Two Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Audio Serial Port (ASP)
    • I2S
    • AC97 Audio Codec Interface
    • Standard Voice Codec Interface (AIC12)
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Media Independent Interface (MII)
  • VLYNQ™ Interface (FPGA Interface)
  • Host Port Interface (HPI) with 16-Bit Multiplexed
    Address/Data
  • USB Port With Integrated 2.0 PHY
    • USB 2.0 High-/Full-Speed (480-Mbps) Client
    • USB 2.0 High-/Full-/Low-Speed Host (Mini-Host,
      Supporting One External Device)
  • Three Pulse Width Modulator (PWM) Outputs
  • On-Chip ARM ROM Bootloader (RBL) to Boot
    From NAND Flash or UART
  • ATA/ATAPI I/F (ATA/ATAPI-6 Specification)
  • Individual Power-Saving Modes for ARM/DSP
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • Up to 71 General-Purpose I/O (GPIO) Pins
    (Multiplexed With Other Device Functions)
  • 361-Pin Pb-Free BGA Package (ZWT Suffix),
    0.8-mm Ball Pitch
  • 0.09-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2-V Internal
  • Applications:
    • Digital Media
    • Networked Media Encode/Decode
    • Video Imaging
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature
      Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

(1) Additional temperature ranges are available - contact factory

All trademarks are the property of their respective owners.

The TMS320DM6446 devices (also referenced as DM6446 and including the SM320DM6446) leverages TI’s DaVinci™ technology to meet the networked media encode and decode application processing needs of next-generation embedded devices.

The DM6446 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the DM6446 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C64x+– DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core incorporates:

  • A coprocessor 15 (CP15) and protection module
  • Data and program Memory Management Units (MMUs) with table look-aside buffers.
  • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT).

The TMS320C64x+™ DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. It is based on an enhanced version of the second-generation high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSP cores an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000™ DSP platform. The TMS320C64x+ DSP is an enhancement of the C64x+™ DSP with added functionality and an expanded instruction set.

Any reference to the C64x™ DSP or C64x™ CPU also applies, unless otherwise noted, to the C64x+™ DSP and C64x+™ CPU, respectively.

With performance of up to 4752 million instructions per second (MIPS) at a clock rate of 594 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2376 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4752 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732).

The DM6446 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6446 core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 640K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 512K-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: 2 configurable video ports; a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; an inter-integrated circuit (I2C) Bus interface; one audio serial port (ASP); 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; up to 71-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UARTs with hardware handshaking support on 1 UART; 3 pulse width modulator (PWM) peripherals; and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The DM6446 device includes a Video Processing Subsystem (VPSS) with two configurable video/imaging peripherals: 1 Video Processing Front-End (VPFE) input used for video capture, 1 Video Processing Back-End (VPBE) output with imaging co-processor (VICP) used for display.

The Video Processing Front-End (VPFE) is comprised of a CCD Controller (CCDC), a Preview Engine (Previewer), Histogram Module, Auto-Exposure/White Balance/Focus Module (H3A), and Resizer. The CCDC is capable of interfacing to common video decoders, CMOS sensors, and Charge Coupled Devices (CCDs). The Previewer is a real-time image processing engine that takes raw imager data from a CMOS sensor or CCD and converts from an RGB Bayer Pattern to YUV4:2:2. The Histogram and H3A modules provide statistical information on the raw color data for use by the DM6446. The Resizer accepts image data for separate horizontal and vertical resizing from 1/4x to 4x in increments of 256/N, where N is between 64 and 1024.

The Video Processing Back-End (VPBE) is comprised of an On-Screen Display Engine (OSD) and a Video Encoder (VENC). The OSD engine is capable of handling 2 separate video windows and 2 separate OSD windows. Other configurations include 2 video windows, 1 OSD window, and 1 attribute window allowing up to 8 levels of alpha blending. The VENC provides four analog DACs that run at 54 MHz, providing a means for composite NTSC/PAL video, S-Video, and/or Component video output. The VENC also provides up to 24 bits of digital output to interface to RGB888 devices. The digital output is capable of 8/16-bit BT.656 output and/or CCIR.601 with separate horizontal and vertical syncs.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM644x and the network. The DM6446 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the ARM, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the ARM, allowing the ARM to poll the link status of the device without continuously performing costly MDIO accesses.

The HPI, I2C, SPI, USB2.0, and VLYNQ ports allow DM6446 to easily control peripheral devices and/or communicate with host processors. The DM6446 also provides multimedia card support, MMC/SD, with SDIO support.

The DM6446 also includes a Video/Imaging Co-processor (VICP) to offload many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. For more information on the VICP enhanced codecs, such as H.264 and MPEG4, please contact your nearest TI sales representative.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6446 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

The TMS320DM6446 devices (also referenced as DM6446 and including the SM320DM6446) leverages TI’s DaVinci™ technology to meet the networked media encode and decode application processing needs of next-generation embedded devices.

The DM6446 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the DM6446 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C64x+– DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core incorporates:

  • A coprocessor 15 (CP15) and protection module
  • Data and program Memory Management Units (MMUs) with table look-aside buffers.
  • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT).

The TMS320C64x+™ DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. It is based on an enhanced version of the second-generation high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSP cores an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000™ DSP platform. The TMS320C64x+ DSP is an enhancement of the C64x+™ DSP with added functionality and an expanded instruction set.

Any reference to the C64x™ DSP or C64x™ CPU also applies, unless otherwise noted, to the C64x+™ DSP and C64x+™ CPU, respectively.

With performance of up to 4752 million instructions per second (MIPS) at a clock rate of 594 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2376 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4752 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732).

The DM6446 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6446 core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 640K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 512K-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: 2 configurable video ports; a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; an inter-integrated circuit (I2C) Bus interface; one audio serial port (ASP); 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; up to 71-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UARTs with hardware handshaking support on 1 UART; 3 pulse width modulator (PWM) peripherals; and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The DM6446 device includes a Video Processing Subsystem (VPSS) with two configurable video/imaging peripherals: 1 Video Processing Front-End (VPFE) input used for video capture, 1 Video Processing Back-End (VPBE) output with imaging co-processor (VICP) used for display.

The Video Processing Front-End (VPFE) is comprised of a CCD Controller (CCDC), a Preview Engine (Previewer), Histogram Module, Auto-Exposure/White Balance/Focus Module (H3A), and Resizer. The CCDC is capable of interfacing to common video decoders, CMOS sensors, and Charge Coupled Devices (CCDs). The Previewer is a real-time image processing engine that takes raw imager data from a CMOS sensor or CCD and converts from an RGB Bayer Pattern to YUV4:2:2. The Histogram and H3A modules provide statistical information on the raw color data for use by the DM6446. The Resizer accepts image data for separate horizontal and vertical resizing from 1/4x to 4x in increments of 256/N, where N is between 64 and 1024.

The Video Processing Back-End (VPBE) is comprised of an On-Screen Display Engine (OSD) and a Video Encoder (VENC). The OSD engine is capable of handling 2 separate video windows and 2 separate OSD windows. Other configurations include 2 video windows, 1 OSD window, and 1 attribute window allowing up to 8 levels of alpha blending. The VENC provides four analog DACs that run at 54 MHz, providing a means for composite NTSC/PAL video, S-Video, and/or Component video output. The VENC also provides up to 24 bits of digital output to interface to RGB888 devices. The digital output is capable of 8/16-bit BT.656 output and/or CCIR.601 with separate horizontal and vertical syncs.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM644x and the network. The DM6446 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the ARM, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the ARM, allowing the ARM to poll the link status of the device without continuously performing costly MDIO accesses.

The HPI, I2C, SPI, USB2.0, and VLYNQ ports allow DM6446 to easily control peripheral devices and/or communicate with host processors. The DM6446 also provides multimedia card support, MMC/SD, with SDIO support.

The DM6446 also includes a Video/Imaging Co-processor (VICP) to offload many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. For more information on the VICP enhanced codecs, such as H.264 and MPEG4, please contact your nearest TI sales representative.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6446 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

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유형 직함 날짜
* Data sheet Digital Media System-on-Chip datasheet (Rev. A) 2009/06/19
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06

설계 및 개발

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디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

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디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

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디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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소프트웨어 코덱

DM644XCODECS Codecs for DM644x - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
DSP(디지털 신호 프로세서)
SM320DM6446-HIREL 높은 안정성 제품 디지털 미디어 DM6446 프로세서 TMS320DM6441 DaVinci 디지털 미디어 시스템 온 칩 TMS320DM6443 DaVinci 디지털 미디어 시스템 온 칩 TMS320DM6446 DaVinci 디지털 미디어 시스템 온 칩
다운로드 옵션
설계 툴

PROCESSORS-3P-SEARCH — Arm 기반 MPU, arm 기반 MCU 및 DSP 타사 검색 툴

TI는 여러 회사와의 협력을 통해 TI 프로세서를 사용하여 광범위한 소프트웨어, 툴 및 SOM을 제공해서 생산 단계로 가는 속도를 높이고 있습니다. 이 검색 툴을 다운로드하여 타사 솔루션을 빠르게 검색하고 필요에 맞는 올바른 타사를 찾아보세요. 여기에 나열된 소프트웨어, 툴 및 모듈은 텍사스 인스트루먼트가 아닌 독립적인 타사에서 생산 및 관리하고 있습니다.

검색 툴은 다음과 같이 제품 유형별로 분류되어 있습니다.

  • 툴에는 IDE/컴파일러, 디버그 및 추적, 시뮬레이션 및 모델링 소프트웨어, 플래시 프로그래머가 포함되어 있습니다.
  • OS에는 (...)
패키지 다운로드
NFBGA (ZWT) 361 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

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