전력 관리 게이트 드라이버 저압측 드라이버

UC3710

활성

5V UVLO, 열 셧다운 및 분할 접지를 지원하는 6A/6A 단일 채널 게이트 드라이버

이 제품의 최신 버전이 있습니다

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
UCC27614 활성 30V VDD, 10A/10A single-channel low-side driver with 4V UVLO and low propagation delay More recent driver with higher drive current, faster switching characteristics and smaller package options

제품 상세 정보

Number of channels 1 Power switch IGBT, MOSFET Peak output current (A) 6 Input supply voltage (min) (V) 4.7 Input supply voltage (max) (V) 18 Features Thermal shutdown Operating temperature range (°C) 0 to 70 Rise time (ns) 25 Fall time (ns) 20 Propagation delay time (µs) 0.035 Input threshold CMOS Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Catalog Undervoltage lockout (typ) (V) 4 Driver configuration Complementary
Number of channels 1 Power switch IGBT, MOSFET Peak output current (A) 6 Input supply voltage (min) (V) 4.7 Input supply voltage (max) (V) 18 Features Thermal shutdown Operating temperature range (°C) 0 to 70 Rise time (ns) 25 Fall time (ns) 20 Propagation delay time (µs) 0.035 Input threshold CMOS Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Catalog Undervoltage lockout (typ) (V) 4 Driver configuration Complementary
PDIP (P) 8 92.5083 mm² 9.81 x 9.43 SOIC (DW) 16 106.09 mm² 10.3 x 10.3 TO-220 (KC) 5 45.212 mm² 10.16 x 4.45
  • Totem Pole Output with 6A Source/Sink Drive
  • 3ns Delay
  • 20ns Rise and Fall Time into 2.2nF
  • 8ns Rise and Fall Time into 30nF
  • 4.7V to 18V Operation
  • Inverting and Non-Inverting Outputs
  • Under-Voltage Lockout with Hysteresis
  • Thermal Shutdown Protection
  • MINIDIP and Power Packages
  • Totem Pole Output with 6A Source/Sink Drive
  • 3ns Delay
  • 20ns Rise and Fall Time into 2.2nF
  • 8ns Rise and Fall Time into 30nF
  • 4.7V to 18V Operation
  • Inverting and Non-Inverting Outputs
  • Under-Voltage Lockout with Hysteresis
  • Thermal Shutdown Protection
  • MINIDIP and Power Packages

The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET\x92s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A.

Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis.

The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for \x9655°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of \x9640°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available.

The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET\x92s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A.

Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis.

The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for \x9655°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of \x9640°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available.

다운로드

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
UCC27322 활성 분할 출력 및 활성화를 지원하는 9A/9A 단일 채널 게이트 드라이버 Higher drive current, no thermal shutdown or slplit ground

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
1개 모두 보기
유형 직함 날짜
* Data sheet High Current FET Driver datasheet 1999/09/05

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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