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CDCVF855 現行 2.5-V 相位鎖定迴路 DDR 時脈驅動器 Can achieve wider frequency ranges

產品詳細資料

Core supply voltage (V) 2.5 Output skew (ps) 50 Operating temperature range (°C) -40 to 85 Rating Catalog
Core supply voltage (V) 2.5 Output skew (ps) 50 Operating temperature range (°C) -40 to 85 Rating Catalog
TSSOP (PW) 28 62.08 mm² 9.7 x 6.4
  • Phase-Lock Loop Clock Driver for Double Data-Rate Synchronous DRAM Applications
  • Spread Spectrum Clock Compatible
  • Operating Frequency: 60 MHz to 180 MHz
  • Low Jitter (cyc–cyc): ±50 ps
  • Distributes One Differential Clock Input to Four Differential Clock Outputs
  • Enters Low Power Mode and Three-State Outputs When Input CLK Signal Is Less Than 20 MHz or PWRDWN Is Low
  • Operates From Dual 2.5-V Supplies
  • 28-Pin TSSOP Package
  • Consumes < 200-µA Quiescent Current
  • External Feedback PIN (FBIN, FBIN\) Are Used to Synchronize the Outputs to the Input Clocks

  • Phase-Lock Loop Clock Driver for Double Data-Rate Synchronous DRAM Applications
  • Spread Spectrum Clock Compatible
  • Operating Frequency: 60 MHz to 180 MHz
  • Low Jitter (cyc–cyc): ±50 ps
  • Distributes One Differential Clock Input to Four Differential Clock Outputs
  • Enters Low Power Mode and Three-State Outputs When Input CLK Signal Is Less Than 20 MHz or PWRDWN Is Low
  • Operates From Dual 2.5-V Supplies
  • 28-Pin TSSOP Package
  • Consumes < 200-µA Quiescent Current
  • External Feedback PIN (FBIN, FBIN\) Are Used to Synchronize the Outputs to the Input Clocks

The CDCV855 is a high-performance, low-skew, low-jitter zero delay buffer that distributes a differential clock input pair (CLK, CLK\) to four differential pairs of clock outputs (Y[0:3], Y[0:3]\) and one differential pair of feedback clock outputs (FBOUT, FBOUT\). When PWRDWN\ is high, the outputs switch in phase and frequency with CLK. When PWRDWN\ is low, all outputs are disabled to a high-impedance state (3-state), and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input frequency detection circuit detects the low-frequency condition and after applying a >20-MHz input signal this detection circuit turns on the PLL again and enables the outputs.

When AVDD is tied to GND, the PLL is turned off and bypassed for test purposes. The CDCV855 is also able to track spread spectrum clocking for reduced EMI.

Since the CDCV855 is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL. This stabilization time is required following power up. The CDCV855 is characterized for both commercial and industrial temperature ranges.

The CDCV855 is a high-performance, low-skew, low-jitter zero delay buffer that distributes a differential clock input pair (CLK, CLK\) to four differential pairs of clock outputs (Y[0:3], Y[0:3]\) and one differential pair of feedback clock outputs (FBOUT, FBOUT\). When PWRDWN\ is high, the outputs switch in phase and frequency with CLK. When PWRDWN\ is low, all outputs are disabled to a high-impedance state (3-state), and the PLL is shut down (low-power mode). The device also enters this low-power mode when the input frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input frequency detection circuit detects the low-frequency condition and after applying a >20-MHz input signal this detection circuit turns on the PLL again and enables the outputs.

When AVDD is tied to GND, the PLL is turned off and bypassed for test purposes. The CDCV855 is also able to track spread spectrum clocking for reduced EMI.

Since the CDCV855 is based on PLL circuitry, it requires a stabilization time to achieve phase-lock of the PLL. This stabilization time is required following power up. The CDCV855 is characterized for both commercial and industrial temperature ranges.

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類型 標題 日期
* Data sheet 2.5-V Phase-Lock Loop Clock Driver datasheet (Rev. A) 2002年 12月 12日

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點