CY54FCT543T
- Function, Pinout, and Drive Compatible With FCT and F Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- 3-State Outputs
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Separation Controls for Data Flow in Each Direction
- Back-to-Back Latches for Storage
- CY54FCT543T
- 48-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT543T
- 64-mA Output Sink Current
- 32-mA Output Source Current
The \x92FCT543T octal latched transceivers contain two sets of eight D-type latches with separate latch-enable (LEAB\, LEBA\) and output-enable (OEAB\, OEBA\) inputs for each set to permit independent control of input and output in either direction of data flow. For data flow from A to B, for example, the A-to-B enable (CEAB\) input must be low in order to enter data from A or to take data from B, as indicated in the function table. With CEAB\ low, a low signal on the A-to-B latch-enable (LEAB\) input makes the A-to-B latches transparent; a subsequent low-to-high transition of the LEAB\ signal puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB\ and OEAB\ low, the 3-state B-output buffers are active and reflect the data present at the output of the A latches. Control of data from B to A is similar, but uses CEBA\, LEBA\, and OEBA\ inputs.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 8-Bit Latched Registered Transceivers With 3-State Outputs datasheet (Rev. A) | 2001年 10月 1日 | |
* | SMD | CY54FCT543T SMD 5962-92221 | 2016年 6月 21日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
User guide | CYFCT Parameter Measurement Information | 2001年 4月 2日 | ||
Selection guide | Advanced Bus Interface Logic Selection Guide | 2001年 1月 9日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (JT) | 24 | Ultra Librarian |
LCCC (FK) | 28 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點