DS92LX1622
- Configurable Data Throughput
- 12–bit (min) up to 600 Mbits/sec
- 16–bit (def) up to 800 Mbits/sec
- 18–bit (max) up to 900 Mbits/sec
- 10 MHz to 50 MHz Input Clock Support
- Embedded Clock with DC Balanced Coding to
Support AC-Coupled Interconnects - Capable to Drive up to 10 Meters Shielded
Twisted-Pair - Bi-Directional Control Interface Channel with
I2C Support - I2C Interface for Device
Configuration. Single-pin ID Addressing - 16–bit Data Payload with CRC (Cyclic
Redundancy Check) for Checking Data Integrity
with Programmable Data Transmission Error
Detection and Interrupt Control - Up to 6 Programmable GPIO’s
- AT-SPEED BIST Diagnosis Feature to Validate
Link Integrity - Individual Power-Down Controls for Both SER
and DES - User-Selectable Clock Edge for Parallel Data
on Both SER and DES - Integrated Termination Resistors
- 1.8V- or 3.3V-Compatible Parallel Bus Interface
- Single Power Supply at 1.8V
- IEC 61000–4–2 ESD Compliant
- No Reference Clock Required on Deserializer
- Programmable Receive Equalization
- LOCK Output Reporting Pin to Ensure Link
Status - EMI/EMC Mitigation
- DES Programmable Spread Spectrum (SSCG)
Outputs - DES Receiver Staggered Outputs
- DES Programmable Spread Spectrum (SSCG)
- Temperature Range −40°C to +85°C
- SER Package: 32 Pin WQFN (5mm × 5mm)
- DES Package: 40 Pin WQFN (6mm × 6mm)
The DS92LX1621 / DS92LX1622 chipset offers a Channel Link III interface with a high-speed forward channel and a full-duplex back channel for data transmission over a single differential pair. The Serializer/Deserializer pair is targeted for direct connections between automotive camera systems and Host Controller/Electronic Control Unit (ECU). The primary transport sends 16 bits of image data over a single high-speed serial stream together with a low latency bi-directional control channel transport that supports I2C. Included with the 16-bit payload is a selectable data integrity option for CRC (Cyclic Redundancy Check) or parity bit to monitor transmission link errors. Using TI’s embedded clock technology allows transparent full-duplex communication over a single differential pair, carrying asymmetrical bi-directional control information without the dependency of video blanking intervals. This single serial stream simplifies transferring a wide data bus over PCB traces and cable by eliminating the skew problems between parallel data and clock paths. This significantly saves system cost by narrowing data paths that in turn reduce PCB layers, cable width, and connector size and pins.
In addition, the Deserializer inputs provide equalization control to compensate for loss from the media over longer distances. Internal DC balanced encoding/decoding is used to support AC-Coupled interconnects.
The sleep function provides a power-savings mode and a remote wake up interrupt for signaling of a remote device.
The Serializer is offered in a 32-pin WQFN package, and Deserializer is offered in a 40-pin WQFN package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS92LX1621/1622 10-50MHz DC-Balanced Ch Link III SER/DES w/Bidirectional Ctrl Ch datasheet (Rev. I) | 2014年 1月 21日 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
| Application note | DS15BA101 & DS15EA101 Enable Long Reach Applications for Embedded Clock SER/DES (Rev. E) | 2013年 4月 29日 | ||
| User guide | LX16EVK01 Channel Link III Ser/Des Evaluation Kit User Guide | 2012年 1月 25日 | ||
| Application note | Go the Distance: Industrial SerDes with Embedded Clock and Control | 2010年 10月 20日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
LX16EVK01 — LX16EVK01 評估套件
The LX16EVK01 is an evaluation kit designed to demonstrate the performance and capabilities of the DS92LX1621 and DS92LX1622 Channel Link III Serializer/Deserializer chipset.
The DS92LX1621 serializer board accepts LVCMOS input signals for the high speed forward channel and provides additional (...)PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 引腳 | 下載 |
|---|---|---|
| WQFN (RTA) | 40 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。