LM4927
- Fully Differential Amplification
- Available in Space-Saving Micro-Array WSON Package
- Ultra Low Current Shutdown Mode
- Can Drive Capacitive Loads up to 100pF
- Improved Pop & Click Circuitry Eliminates Noises During Turn-On and Turn-Off Transitions
- 2.4 - 5.5V Operation
- No Output Coupling Capacitors, Snubber Networks or Bootstrap Capacitors Required
Key Specifications
- Improved PSRR at 217Hz, 85dB (Typ)
- Power Output at 5.0V @ 10% THD (4Ω), 2.5W (Typ)
- Power Output at 3.3V @ 1% THD, 550mW (Typ)
- Shutdown Current, 0.1µA (Typ)
Boomer is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
The LM4927 is a fully differential audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 2.5 watts of continuous average power to a 4Ω load with less than 10% distortion (THD+N) from a 5VDC power supply.
Boomer audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components. The LM4927 does not require output coupling capacitors or bootstrap capacitors, and therefore is ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.
The LM4927 features a low-power consumption shutdown mode. To facilitate this, Shutdown may be enabled by logic low. Additionally, the LM4927 features an internal thermal shutdown protection mechanism.
The LM4927 contains advanced pop & click circuitry which eliminates noises which would otherwise occur during turn-on and turn-off transitions.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LM4927 2.5 Watt Fully Differential Audio Power Amplifier With Shutdown datasheet (Rev. B) | 2013年 4月 6日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WSON (NGQ) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點