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ONET1101L

停產

11.3-Gbps 雷射二極體驅動器

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產品規格表

ONET1101L

停產
產品規格表 立即訂購

產品詳細資料

Type Laser driver Data rate (max) (Mbps) 11300 Features 2-wire interface, Automatic power control loop, Bias current digital select, Modulation current digital select Supply current (typ) (µA) 66000 Imod (A) 0.085 Supply current (max) (µA) 118000 Deterministic jitter (typ) (ps) 5 Operating temperature range (°C) -25 to 100
Type Laser driver Data rate (max) (Mbps) 11300 Features 2-wire interface, Automatic power control loop, Bias current digital select, Modulation current digital select Supply current (typ) (µA) 66000 Imod (A) 0.085 Supply current (max) (µA) 118000 Deterministic jitter (typ) (ps) 5 Operating temperature range (°C) -25 to 100
VQFN (RGE) 24 16 mm² 4 x 4
  • Up to 11.3 Gbps Operation
  • Two-Wire Digital Interface
  • Digitally Selectable Modulation Current up to 80 mA
  • Digitally Selectable Bias Current up to 100 mA Source or Sink
  • Automatic Power Control (APC) Loop
  • Supports Transceiver Management System (TMS)
  • Programmable Input Equalizer
  • Cross-point Control
  • Includes Laser Safety Features
  • Adjustable Coupling Ratio
  • Single +3.3 V Supply
  • Case Temperature -25°C to 100°C
  • Small Surface Mount Footprint 4mm × 4mm
    24-Pin, RoHS-compliant QFN Package
  • APPLICATIONS
    • 10 Gigabit Ethernet Optical Transmitters
    • 8x and 10x Fibre Channel Optical Transmitters
    • SONET OC-192/SDH STM-64 Optical Transmitters
    • XFP and SFP+ Transceiver Modules
    • XENPAK, XPAK, X2 and 300-pin MSA Transponder Modules
  • Up to 11.3 Gbps Operation
  • Two-Wire Digital Interface
  • Digitally Selectable Modulation Current up to 80 mA
  • Digitally Selectable Bias Current up to 100 mA Source or Sink
  • Automatic Power Control (APC) Loop
  • Supports Transceiver Management System (TMS)
  • Programmable Input Equalizer
  • Cross-point Control
  • Includes Laser Safety Features
  • Adjustable Coupling Ratio
  • Single +3.3 V Supply
  • Case Temperature -25°C to 100°C
  • Small Surface Mount Footprint 4mm × 4mm
    24-Pin, RoHS-compliant QFN Package
  • APPLICATIONS
    • 10 Gigabit Ethernet Optical Transmitters
    • 8x and 10x Fibre Channel Optical Transmitters
    • SONET OC-192/SDH STM-64 Optical Transmitters
    • XFP and SFP+ Transceiver Modules
    • XENPAK, XPAK, X2 and 300-pin MSA Transponder Modules

The ONET1101L is a high-speed, 3.3-V laser driver designed to directly modulate a laser at data rates from 2 Gbps to 11.3 Gbps.

The device provides a two-wire serial interface that helps digital control of the modulation, plus bias currents and cross point, eliminating the need for external components. An optional input equalizer can be used for equalization of up to 300 mm (12") of microstrip or stripline transmission line on FR4 printed circuit boards.

The ONET1101L includes an integrated automatic power control (APC) loop, plus circuitry to support laser safety and transceiver management systems.

The laser driver is characterized for operation from -25°C to 100°C case temperature and is available in a small footprint using a 4mm × 4mm, 24-pin RoHS-compliant QFN package.

The ONET1101L is a high-speed, 3.3-V laser driver designed to directly modulate a laser at data rates from 2 Gbps to 11.3 Gbps.

The device provides a two-wire serial interface that helps digital control of the modulation, plus bias currents and cross point, eliminating the need for external components. An optional input equalizer can be used for equalization of up to 300 mm (12") of microstrip or stripline transmission line on FR4 printed circuit boards.

The ONET1101L includes an integrated automatic power control (APC) loop, plus circuitry to support laser safety and transceiver management systems.

The laser driver is characterized for operation from -25°C to 100°C case temperature and is available in a small footprint using a 4mm × 4mm, 24-pin RoHS-compliant QFN package.
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類型 標題 日期
* Data sheet 11.3 Gbps Laser Diode Driver datasheet 2008年 3月 17日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點