PCA9535
- Low standby-current consumption of 1 µA Max
- I2C to Parallel port expander
- Open-drain active-low interrupt output
- 5-V Tolerant I/O ports
- Compatible with most microcontrollers
- 400-kHz Fast I2C Bus
- Address by three hardware address pins for use of up to eight devices
- Polarity inversion register
- Latched outputs with high-current drive capability for directly driving LEDs
- Latch-up performance exceeds 100 mA Per JESD 78, class II
- ESD Protection exceeds JESD 22
- 2000-V Human-body model (A114-A)
- 1000-V Charged-device model (C101)
INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C bus. Thus, the PCA9535 can remain a simple slave device.
The device outputs (latched) have high-current drive capability for directly driving LEDs. The device has low current consumption.
Although pin-to-pin and I2C address compatible with the PCF8575, software changes are required due to the enhancements.
The PCA9535 is identical to the PCA9555, except for the removal of the internal I/O pullup resistor, which greatly reduces power consumption when the I/Os are held low.
Three hardware pins (A0, A1, and A2) are used to program and vary the fixed I2C address and allow up to eight devices to share the same I2C bus or SMBus. The fixed I2C address of the PCA9535 is the same as the PCA9555, PCF8575, PCF8575C, and PCF8574, allowing up to eight of these devices in any combination to share the same I2C bus or SMBus.
技術文件
設計與開發
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I2C-DESIGNER — I2C 設計工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 24 | Ultra Librarian |
SSOP (DB) | 24 | Ultra Librarian |
SSOP (DBQ) | 24 | Ultra Librarian |
TSSOP (PW) | 24 | Ultra Librarian |
TVSOP (DGV) | 24 | Ultra Librarian |
VQFN (RGE) | 24 | Ultra Librarian |
WQFN (RTW) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。