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SN55LVDS31-SP

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SN55LVDS31-SP

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產品詳細資料

Function Driver Protocols LVDS Number of transmitters 4 Number of receivers 0 Supply voltage (V) 3.3 Signaling rate (Mbps) 400 Input signal LVTTL Output signal LVDS Rating Space Operating temperature range (°C) -55 to 125
Function Driver Protocols LVDS Number of transmitters 4 Number of receivers 0 Supply voltage (V) 3.3 Signaling rate (Mbps) 400 Input signal LVTTL Output signal LVDS Rating Space Operating temperature range (°C) -55 to 125
CFP (W) 16 69.319 mm² 10.3 x 6.73
  • QML-V Qualified, SMD 5962-97621
  • Meet or Exceed the Requirements of ANSI TIA/EIA-644 Standard
  • Low-Voltage Differential Signaling With Typical Output Voltage
    of 350 mV and 100-Ω Load
  • Typical Output Voltage Rise and Fall Times of 500 ps (400 Mbps)
  • Typical Propagation Delay Times of 1.7 ns
  • Operate From a Single 3.3-V Supply
  • Power Dissipation 25 mW Typical Per Driver at 200 MHz
  • Driver at High Impedance When Disabled or With VCC = 0
  • Bus-Terminal ESD Protection Exceeds 8 kV
  • Low-Voltage TTL (LVTTL) Logic Input Levels
  • Cold Sparing for Space and High Reliability Applications Requiring Redundancy
  • QML-V Qualified, SMD 5962-97621
  • Meet or Exceed the Requirements of ANSI TIA/EIA-644 Standard
  • Low-Voltage Differential Signaling With Typical Output Voltage
    of 350 mV and 100-Ω Load
  • Typical Output Voltage Rise and Fall Times of 500 ps (400 Mbps)
  • Typical Propagation Delay Times of 1.7 ns
  • Operate From a Single 3.3-V Supply
  • Power Dissipation 25 mW Typical Per Driver at 200 MHz
  • Driver at High Impedance When Disabled or With VCC = 0
  • Bus-Terminal ESD Protection Exceeds 8 kV
  • Low-Voltage TTL (LVTTL) Logic Input Levels
  • Cold Sparing for Space and High Reliability Applications Requiring Redundancy

The SN55LVDS31 is a differential line driver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. This driver will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.

The intended application of this device and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The SN55LVDS31 is characterized for operation from –55°C to 125°C.

The SN55LVDS31 is a differential line driver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. This driver will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.

The intended application of this device and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The SN55LVDS31 is characterized for operation from –55°C to 125°C.
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重要文件 類型 標題 格式選項 日期
* Radiation & reliability report SN55LVDS31 and SN55LVDS32 SEE Report 2015年 3月 31日
* Radiation & reliability report SN55LVDS31J Radiation Test Report 2015年 3月 31日
* Data sheet High-Speed Differential Line Driver - SN55LVDS31-SP datasheet 2012年 3月 1日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點