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SN74ABT162500

現行

具有 3 態輸出的 18 位元通用匯流排收發器

立即訂購
產品規格表

SN74ABT162500

現行
產品規格表 立即訂購

產品詳細資料

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type Push-Pull Features Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type Push-Pull Features Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35
  • Members of the Texas Instruments WidebusTM Family
  • B-Port Outputs Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL) Package and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    Widebus, EPIC-IIB, and UBT are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • B-Port Outputs Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL) Package and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    Widebus, EPIC-IIB, and UBT are trademarks of Texas Instruments Incorporated.

These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs.

For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. Output-enable OEAB is active high. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high and OEBA\ is active low).

The B-port outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN54ABT162500 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT162500 is characterized for operation from -40°C to 85°C.

A-to-B data flow is shown: B-to-A flow is similar but uses OEBA\, LEBA, and CLKBA\.

Output level before the indicated steady-state input conditions were established

§ Output level before the indicated steady-state input conditions were established, provided that CLKAB\ was low before LEAB went low

These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs.

For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. Output-enable OEAB is active high. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high and OEBA\ is active low).

The B-port outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN54ABT162500 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT162500 is characterized for operation from -40°C to 85°C.

A-to-B data flow is shown: B-to-A flow is similar but uses OEBA\, LEBA, and CLKBA\.

Output level before the indicated steady-state input conditions were established

§ Output level before the indicated steady-state input conditions were established, provided that CLKAB\ was low before LEAB went low
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類型 標題 日期
* Data sheet 18-Bit Universal Bus Transceivers With 3-State Outputs datasheet (Rev. E) 1999年 2月 19日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004年 2月 16日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
Selection guide Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997年 3月 1日
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996年 12月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

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