產品詳細資料

Audio input type Analog Input Architecture Class-D Speaker channels (max) Stereo Control interface GPIO Output power (W) 2.1 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.14 Load (min) (Ω) 4 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Stereo Control interface GPIO Output power (W) 2.1 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.14 Load (min) (Ω) 4 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
WQFN (RTJ) 20 16 mm² (4 mm × 4 mm) DSBGA (YZH) 16 5.0625 mm² (— mm × — mm)
  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™
  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TPA2012D2 2.1-W/Channel Stereo Filter-Free Class-D Audio Power Amplifier datasheet (Rev. F) PDF | HTML 2017/3/14
應用說明 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019/8/26
應用說明 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019/6/27
應用說明 AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013/5/1
更多文件說明 TPA2012D2_NanoEVM_ Schematic 2007/2/13
更多文件說明 TPA2012D2_NanoEVM_OV 2007/1/29
應用說明 Measuring Class-D Amplifiers for Audio Speaker Overstress Testing 2005/10/28
使用指南 TPA2012D2EVM - User Guide (Rev. A) 2005/4/7

設計與開發

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開發板

CC3200AUDBOOST — SimpleLink Wi-Fi CC3200 音訊 BoosterPack

SimpleLink™ Wi-Fi® CC3200 音訊 BoosterPack 可利用 SimpleLink™ Wi-Fi® CC3200 裝置上的數位音訊週邊設備 [I2S] 進行評估與開發。其包含用於驅動喇叭的 D 類功率放大器以及和支援可編程音訊處理的超低功耗音訊轉碼器 TLV320AIC3254。喇叭、耳機和麥克風另售。

此 BoosterPack 可與 SimpleLink™ Wi-Fi® CC3200 LaunchPad™ (CC3200-LAUNCHXL)SimpleLink™ 多標準 CC26x2R 無線 MCU LaunchPad™ 開發套件SimpleLink™ (...)

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開發板

TPA2012D2EVM — TPA2012D2 評估模組 (EVM)

The TPA2012D2 EVM is a Pb-free, highly-efficient, filter-free stereo audio power amplifier evaluation module. It consists of the TI TPA2012D2 1.65 W low-voltage stereo Class-D audio power amplifier IC in a very small NanoFree™ wafer chip scale package (WCSP). All devices including the (...)

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模擬型號

TPA2012D2 PSpice Model

SLOM162.ZIP (6 KB) - PSpice 模型
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模擬型號

TPA2012D2 TINA-TI Reference Design

SLOM160.TSC (37 KB) - TINA-TI 參考設計
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模擬型號

TPA2012D2 TINA-TI Spice Model

SLOM159.ZIP (22 KB) - TINA-TI Spice 模型
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參考設計

TIDC-CC3200AUDBOOST — 適用於 SimpleLink Wi-Fi CC3200 Launchpad 的 Wi-Fi 音訊串流應用

這款 SimpleLink Wi-Fi CC3200 LaunchPad 和音訊 BoosterPack 設計可為新應用及 HD 數位喇叭等現有應用帶來 Wi-Fi 音訊串流功能。它可從數位麥克風或立體聲/單聲道音訊插孔擷取、串流及播放音訊至另一個支援 Wi-Fi 的裝置。接收到的 Wi-Fi 音訊可透過板載立體聲音訊插孔或端子台傳輸至立體聲或數位喇叭。

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封裝 針腳 CAD 符號、佔位空間與 3D 模型
WQFN (RTJ) 20 Ultra Librarian
DSBGA (YZH) 16 Ultra Librarian

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