TPA2018D1
- Filter-Free Class-D Architecture
- 3 W Into 4 at 5 V (10% THD+N)
- 880 mW Into 8 at 3.6 V (10% THD+N)
- Power Supply Range: 2.5 V to 5.5 V
- Flexible Operation With/Without I2C
- Programmable DRC/AGC Parameters
- Digital I2C Volume Control
- Selectable Gain from -28 dB to 30 dB in 1-dB Steps (when compression is used)
- Selectable Attack, Release and Hold Times
- 4 Selectable Compression Ratios
- Low Supply Current: 1.8 mA
- Low Shutdown Current: 0.2 µA
- High PSRR: 80 dB
- Fast Start-up Time: 5 ms
- AGC Enable/Disable Function
- Limiter Enable/Disable Function
- Short-Circuit and Thermal Protection
- Space-Saving Package
- 1,63 mm × 1,63 mm Nano-Free WCSP (YZF)
- APPLICATIONS
- Wireless or Cellular Handsets and PDAs
- Portable Navigation Devices
- Portable DVD Player
- Notebook PCs
- Portable Radio
- Portable Games
- Educational Toys
- USB Speakers
The TPA2018D1 is a mono, filter-free Class-D audio power amplifier with volume control, dynamic range compression (DRC) and automatic gain control (AGC). It is available in a 1.63 mm x 1.63 mm WCSP package.
The DRC/AGC function in the TPA2018D1 is programmable via a digital I2C interface. The DRC/AGC function can be configured to automatically prevent distortion of the audio signal and enhance quiet passages that are normally not heard. The DRC/AGC can also be configured to protect the speaker from damage at high power levels and compress the dynamic range of music to fit within the dynamic range of the speaker. The gain can be selected from -28 dB to +30 dB in 1-dB steps. The TPA2018D1 is capable of driving 3 W at 5 V into 4 load or 880 mW at 3.6 V into 8 load. The device features hardware and software shutdown controls and also provides thermal and short-circuit protection.
In addition to these features, a fast start-up time and small package size make the TPA2018D1 an ideal choice for cellular handsets, PDAs and other portable applications.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 3-W Mono Class-D Audio Amplifier with SmartGain | 2009年 8月 1日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 引腳 | 下載 |
---|---|---|
DSBGA (YZF) | 9 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點