TPA301
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V - 5.5 V
- Output Power for RL = 8
- 350 mW at VDD = 5 V, BTL
- 250 mW at VDD = 3.3 V, BTL
- Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
PowerPAD is a trademark of Texas Instruments Incorporated.
The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TPA301: 350-mW Mono Audio Power Amplifier datasheet (Rev. E) | 2004/6/24 | |||
| 應用說明 | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018/7/6 | ||||
| 使用指南 | TPA301EVM - User Guide (Rev. A) | 2001/4/17 |
設計與開發
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TPA301EVM — TPA301 評估模組 (EVM)
A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.
BOOSTXL-AUDIO — 音頻訊號處理 BoosterPack 插入式模組
插入 LaunchPad™ 開發套件時，BOOSTXL-AUDIO BoosterPack™ 外掛程式模組可擷取來自麥克風的音訊輸入，並透過板載喇叭輸出音訊。還支援耳機輸入和輸出。此音訊輸入/輸出串流可讓開發人員實驗附加 LaunchPad 開發套件上微控制器 (MCU) 的數位訊號處理 (DSP) 和濾波功能。
有多種選項（可透過 BoosterPack 上的跨接器選擇）將喇叭連接至 Launchpad 的 MCU：(1) 透過 SPI 將音訊資料輸出到音訊 BoosterPack 上提供的 SPI DAC；(2) 直接連接到 LaunchPad MCU 上的 DAC（若有）；或 (3) (...)
TIDM-VOICEBANDAUDIO — 使用 PWM DAC 的語音頻帶音訊重播
透過產生 PWM 的定時器，並搭配外部低通濾波器和放大器級，實現低成本音訊輸出，可用於耳機或喇叭。音訊資料儲存在板載 SPI 快閃記憶體中。提供含 Launchpad 直通碼的 PC GUI，可將音訊資料載入 SPI 快閃記憶體。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。