TPA3101D2
- 10-W/ch into an 8-
Load From a 13-V Supply - 9.2-W/ch into an 8- Load From a 12-V Supply
- Operates from 10 V to 26 V
- 87% Efficient Class-D Operation Eliminates Need for Heat Sinks
- Four Selectable, Fixed Gain Settings
- Differential Inputs
- Thermal and Short-Circuit Protection With Auto Recovery Feature
- Clock Output for Synchronization With Multiple Class-D Devices
- Surface Mount 7 mm × 7 mm, 48-pin QFN Package
- Surface Mount 7 mm × 7 mm, 48-pin HTQFP Package
- APPLICATIONS
- Televisions
The TPA3101D2 is a 10-W (per channel) efficient, Class-D audio power amplifier for driving bridged-tied stereo speakers. The TPA3101D2 can drive stereo speakers as low as 4 . The high efficiency of the TPA3101D2, 87%, eliminates the need for an external heat sink when playing music.
The gain of the amplifier is controlled by two gain select pins. The gain selections are 20, 26, 32, 36 dB.
The outputs are fully protected against shorts to GND, VCC, and output-to-output shorts with an auto recovery feature and monitor output.
技術文件
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檢視所有 9 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | 10W Stereo Class-D Audio Power Amp datasheet (Rev. C) | 2010年 8月 19日 | |
| Application note | Using Thermal Calculation Tools for Analog Components (Rev. A) | 2019年 8月 30日 | ||
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
| Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 | ||
| Application note | Interfacing External Devices to the TPA310xDx Amplifiers | 2008年 9月 29日 | ||
| User guide | TPA3101D2EVM - User Guide (Rev. A) | 2007年 7月 9日 | ||
| Application note | TPA3100D2 Mono Amplifier Configuration (Rev. A) | 2007年 4月 16日 | ||
| User guide | TPA3101D2EVM - User Guide | 2005年 12月 14日 |
設計與開發
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模擬工具
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| 封裝 | 引腳 | 下載 |
|---|---|---|
| HTQFP (PHP) | 48 | 檢視選項 |
| VQFN (RGZ) | 48 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。