TPA6133A2
- DirectPath™ Ground-Referenced Outputs
- Eliminates Output DC Blocking Capacitors
- Reduces Board Area
- Reduces Component Height and Cost
- Full Bass Response Without Attenuation
- Power Supply Voltage Range: 2.5 V to 5.5 V
- High Power Supply Rejection Ratio
(>100 dB PSRR) - Differential Inputs for Maximum Noise Rejection
(69 dB CMRR) - High-Impedance Outputs When Disabled
- Advanced Pop and Click Suppression Circuitry
- GPIO Control for Shutdown
- 20 Pin, 4 mm × 4 mm WQFN Package
The TPA6133A2 is a stereo DirectPath™ headphone amplifier with GPIO control. The TPA6133A2 has minimal quiescent current consumption, with a typical IDD of 4.2 mA, making it optimal for portable applications. The GPIO control allows the device to be put in a low power shutdown mode.
The TPA6133A2 is a high fidelity amplifier with an SNR of 93 dB. A PSRR greater than 100 dB enables direct-to-battery connections without compromising the listening experience. The output noise of 12 µVrms (typical A-weighted) provides a minimal noise background during periods of silence. Configurable differential inputs and high CMRR allow for maximum noise rejection in the noisy environment of a mobile device.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPA6133A2 138-mW DirectPath™ Stereo Headphone Amplifier datasheet (Rev. B) | PDF | HTML | 2014年 9月 11日 |
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 |
設計與開發
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TPA6133A2EVM — 適用於 TPA6133A2 DirectPath™ 耳機放大器的評估板
The TPA6133A2 is a DirectPath™ stereo headphone amplifier capable of delivering 138 mW/Ch into 16Ω and requires no output DC blocking capacitors. It has a fixed gain of +4 dB.
The TPA6133A2EVM is a complete, stand-alone audio board. It contains the TPA6133A2QFN (RTJ) DirectPath™ stereo (...)
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PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WQFN (RTJ) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。