TUSB546A-DCI
- USB Type-C crosspoint switch supporting
- USB 3.1 SS + 2 DP lanes
- 4 DP lanes
- USB 3.1 Gen1 up to 5 Gbps
- DisplayPort™ 1.4 up to 8.1 Gbps (HBR3)
- VESA DisplayPort alt mode DFP redriving crosspoint switch supporting c, d, e and f configurations
- Ultra-low-power architecture
- Linear redriver with up to 14 dB equalization
- Transparent to DisplayPort link training
- Automatic LFPS de-emphasis control to meet USB 3.1 certification requirements
- Configuration through GPIO or I2C
- Intel proprietary DCI capability on USB Type-C™ for closed chassis debugging
- Hot-plug capable
- Industrial temperature range: -40ºC to 85ºC (TUSB546AI-DCI)
- Commercial temperature range: 0ºC to 70ºC (TUSB546A-DCI)
- 4 mm x 6 mm, 0.4 mm pitch WQFN package
The TUSB546A-DCI is a VESA USB Type-C™ Alt Mode redriving switch supporting USB 3.1 data rates up to 5 Gbps and DisplayPort 1.4 up to 8.1 Gbps for downstream facing port (Host). The device is used for configurations C, D, E, and F from the VESA DisplayPort Alt Mode on USB Type-C Standard Version 1.1. This protocol-agnostic linear redriver is also capable of supporting other USB Type-C Alt Mode interfaces.
The TUSB546A-DCI provides several levels of receive linear equalization to compensate for inter symbol interference (ISI) due to cable and board trace loss. Operates on a single 3.3-V supply and comes in a commercial temperature range and industrial temperature range.
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設計與開發
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TUSB546EVM — TUSB546 USB Type-C™ 替代模式訊號調節開關評估模組
TUSB546 USB Type-C™ 備用模式訊號調節器開關評估模組 (TUSB546EVM) 提供 USB Type-C 備用模式訊號調節器開關,可透過 USB Type-C 下行埠 (主機) 介面實現 5Gbps USB 資料和 8.1Gbps DisplayPort™ 視訊。 EVM 配備 TUSB546-DCI 5G USB Type-C 線性訊號調節器開關與 TPS65982 Type-C PD 控制器的雙晶片解決方案,為 USB 和視訊提供更出色的訊號完整性,以及電源傳輸功能性。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WQFN (RNQ) | 40 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。