Bluetooth and MSP430 Audio Sink Reference Design


Design files


TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio implementation and with full design files provided allows you to focus your efforts on application and end product development. Software supported on this reference design includes the TI Bluetooth Stack.

Please note that the MSP430 memory size does not allow any additional application space, so the use case should be audio sink only as described For additional application space please consider using higher flash device, for example MSP430F5438.

  • Enables Bluetooth audio (SBC encode/decode) with low cost, low power MSP430F5229
  • Design offloads audio processing from MCU to the Bluetooth device which enables low power audio
  • Cost effective low end wireless audio solution for under with a 4 layer layout and QFN packages
  • Core of the solution is TI's CC2564 which is best in class Bluetooth performance (+12dBm output power)
  • Design also uses TI's  low power digital input speaker amplifier (TAS2505) & USB charge management device ( BQ24055)
  • CC256x and TI Bluetooth Stack both have Bluetooth Subsystem QDIDs allowing you to only need a Bluetooth End Product Listing
?? View video with transcript Video

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDR322.PDF (48 K)

Detailed schematic diagram for design layout and components

TIDC193.ZIP (1257 K)

Detailed schematic diagram for design layout and components

TIDR278.PDF (86 K)

Detailed schematic diagram for design layout and components

TIDR279A.PDF (92 K)

Complete listing of design components, reference designators, and manufacturers/part numbers


Includes TI products in the design and potential alternatives.

MSP430 microcontrollers

MSP430F522925 MHz MCU with 128KB Flash, 8KB SRAM, 10-bit ADC, comparator, DMA, 1.8V Split-Rail I/O

Data sheet: PDF | HTML
Speaker amps

TAS25052-W, mono, digital & analog input Class-D audio amp with audio processing & mono headphone amplifier

Data sheet: PDF | HTML
Wi-Fi products

CC2560Bluetooth® 4.0 with enhanced data rate (EDR)

Data sheet: PDF | HTML
Wi-Fi products

CC2564Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT

Data sheet: PDF | HTML
Wi-Fi products

CC2564MODABluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna

Data sheet: PDF
Wi-Fi products

CC2564MODNBluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module

Data sheet: PDF

Technical documentation

No results found. Please clear your search and try again.
View all 3
Type Title Date
Certificate BT-MSPAUDSINK EC Declaration of Conformity (DoC) (Rev. A) Jan. 02, 2019
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) Feb. 03, 2016
User guide Bluetooth and MSP430 Audio Quick Start Guide Nov. 05, 2013

Related design resources

Hardware development

CC2564MODNEM Dual-mode Bluetooth® CC2564 module evaluation board CC256XQFNEM Dual-mode Bluetooth® CC2564 evaluation board

Software development

TIBLUETOOTHSTACK-SDK TI Dual-Mode Bluetooth® Stack
CC256XM4BTBLESW TI dual-mode Bluetooth® stack on TM4C MCUs CC256XMSPBTBLESW TI Dual-mode Bluetooth® stack on MSP430™ MCUs

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​