CC256XSTBTBLESW

STM32F4 MCU 的 TI 雙模式 Bluetooth® 堆疊

CC256XSTBTBLESW

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概覽

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 and QDID 69886), provides simple command line sample applications to speed development, and upon request has MFI capability.

For a complete evaluation solution, the CC256XSTBTBLESW works directly with the hardware development kit: STM3240G-EVAL. Moreover the stack that is available for the STM32 MCU, is certified and royalty-free (CC256XSTBTBLESW).

The software works with all CC256x EM boards (CC256XQFNEM and CC2564MODNEM) which provide a complete Bluetooth BR/EDR/LE HCI solution, reducing design effort and enabling fast time to market. The CC256x EM boards include TI's seventh-generation Bluetooth core and provide a product-proven solution that is Bluetooth 4.1 compliant. The devices provide best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

特點
  • Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royalty free
  • The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886)
  • Fully Thread safe
  • Supports threaded (RTOS) and non-threaded (No OS) environment
  • Fully Documented API Interface
  • Works with any STM32F4 MCU
  • Sample Apps are available for the STM3240G-EVAL MCU development kit with the support of the CC256XEM-STADAPT
  • Protocols/Profiles can be selectively enabled/disabled
  • Supports Keil and IAR IDEs
  • Classic Profiles Available
    • Advanced Audio Distribution Profile (A2DP): A3DP Implementation
    • Audio/Video Remote Control Profile (AVRCP)
    • Device ID Profile (DI)
    • Generic Access Profile (GAP )
    • Generic Audio/Video Distribution Profile (GAVDP)
    • Headset Profile (HSP)
    • Hands Free Profile (HFP)
    • Human Interface Device Profile (HID)
    • Phonebook Access Profile (PBAP)
    • Serial Port Profile (SPP)
  • Bluetooth Low Energy Profiles Available
    • Alert Notification Service (ANS)
    • Alert Notification Profile (ANP)
    • Battery Service (BAS)
    • Device Information Service (DIS)
    • Find Me Profile (FMP)
    • Generic Access Profile Service (GAPS)
    • Generic Attribute Profile (GATT)
    • Health Thermometer Service (HTS)
    • Health Thermometer Profile (HTP)
    • Heart Rate Service (HRS)
    • Heart Rate Profile (HRP)
    • Human Interface Device Service (HIDS)
    • HID over GATT Profile (HOGP)
    • Immediate Alert Service (IAS)
    • Link Loss Service (LLS)
    • Phone Alert State Service (PASS)
    • Phone Alert State Profile (PASP)
    • Proximity Profile (PXP)
    • TX Power Service (TPS)
Wi-Fi 產品
CC2560 具強化資料速率 (EDR) 的 Bluetooth® 4.0 CC2564 具強化資料率 (EDR)、低功耗 LE 和 ANT 的 Bluetooth® 4.0 CC2564MODA 具有整合式天線的 Bluetooth® 雙模式收發器模組 CC2564MODN Bluetooth® 雙模式收發器模組
下載 觀看有字幕稿的影片 影片

訂購並開始開發

探索硬體、軟體和文件的套件

硬體和軟體套件

Get started and develop with our dual-mode Bluetooth solutions with ST Micro's STM32F4 EVM

檢視套件

Get started and develop with our dual-mode Bluetooth solutions with ST Micro's STM32F4 EVM

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Start Bluetooth development on ST Micro's based MCUs with our example code, software, hardware, tools, and documentation.
開發板

CC256XCQFN-EM — CC2564C 雙模式藍牙® 控制器評估模組

Required
為什麼我需要此項? This EVM allows you to get started and develop on our latest dual-mode BT5.1 certified devices.
支援產品和硬體
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限制:
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CC256XCQFN-EM CC2564C 雙模式藍牙® 控制器評估模組

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介面轉接器

CC256XEM-STADAPT — CC256xEM Bluetooth® Adapter Kit

Required
為什麼我需要此項? This adapter plugs into the STM32F4 EVM connectors and COM8 board which allows you to start development.
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CC256XEM-STADAPT CC256xEM Bluetooth® Adapter Kit

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介面轉接器

CC256XSTBTBLESW — TI Dual-mode Bluetooth® stack on STM32F4 MCUs

Required
為什麼我需要此項? This software provides you support for Bluetopia Bluetooth Stack on a STM32F4 MCU.
支援產品和硬體

CC256XSTBTBLESW TI Dual-mode Bluetooth® stack on STM32F4 MCUs

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驅動程式或資料庫

CC256XC-BT-SP — Bluetooth® Service Pack for CC256xC

lock = 需要匯出核准 (1 分鐘)
Required
為什麼我需要此項? The service pack is loaded during initialization time and, and you will need it for Bluetooth operations, regardless of the stack selection.
支援產品和硬體

CC256XC-BT-SP Bluetooth® Service Pack for CC256xC

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發行日期: 2024/8/23
文件與相關資源

僅訂購此硬體

介面轉接器

CC256XEM-STADAPT — CC256xEM Bluetooth® Adapter Kit

支援產品和硬體
有庫存
限制:
TI.com 上缺貨
TI.com 無法提供

CC256XEM-STADAPT CC256xEM Bluetooth® Adapter Kit

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版本: null
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介面轉接器

CC256XSTBTBLESW — TI Dual-mode Bluetooth® stack on STM32F4 MCUs

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CC256XSTBTBLESW TI Dual-mode Bluetooth® stack on STM32F4 MCUs

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相關設計資源

硬體開發

開發板
CC2564MODNEM 雙模式 Bluetooth® CC2564 模組評估板

參考設計

參考設計
BT-MSPAUDSINK-RD Bluetooth 與 MSP430 音訊接收器參考設計 BT-MSPAUDSOURCE-RD 藍牙和 MSP MCU 音訊來源參考設計 CC256XEM-RD CC256x Bluetooth® 參考設計 TIDA-00554 具有 Bluetooth 連線且適用於可攜式化學分析的 DLP 超行動 NIR 光譜儀

軟體開發

驅動程式或資料庫
CC256XB-BT-SP 適用於 CC256xB 的 Bluetooth Service Pack TI-BT-STACK-LINUX-ADDON 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式
軟體開發套件 (SDK)
TIBLUETOOTHSTACK-SDK TI 雙模式 Bluetooth® 堆疊

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