SNIS214E june   2021  – july 2023 TMP114

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 1.2 V Compatible Logic Inputs
      2. 8.3.2 Cyclic Redundancy Check (CRC)
      3. 8.3.3 Temperature Limits
      4. 8.3.4 Slew Rate Warning
      5. 8.3.5 NIST Traceability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
        1. 8.4.2.1 One-Shot Temperature Conversions
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 I2C and SMBus Interface
      3. 8.5.3 Device Address
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Auto-Increment
        2. 8.5.4.2 Writes
          1. 8.5.4.2.1 CRC Enabled Writes
        3. 8.5.4.3 Reads
          1. 8.5.4.3.1 CRC Enabled Reads
        4. 8.5.4.4 General Call Reset Function
        5. 8.5.4.5 Time-Out Function
        6. 8.5.4.6 Coexist on I3C MixedBus
        7. 8.5.4.7 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Separate I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Equal I2C Pullup and Supply Voltage Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (May 2023) to Revision E (July 2023)

  • Deleted content from the Temperature Data Format sectionGo

Changes from Revision C (May 2022) to Revision D (May 2023)

  • Changed body size to package size in the Package Information tableGo
  • Changed device accuracy for TMP114x products from: 0.3°C to: 0.2°CGo
  • Added additional temperature accuracy range for TMP114Go
  • Changed temperature cycle hysteresis from 0.05°C to 0.1°CGo
  • Changed supply current during active conversion from 110 µA to 120 µAGo
  • Added Standard Mode timing to I2C Interface Timing table Go
  • Changed Figure 7-1 Go
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo

Changes from Revision B (January 2022) to Revision C (May 2022)

  • Added new orderables to the Device Comparison tableGo
  • Added new orderables to the Device Target Address tableGo

Changes from Revision A (September 2021) to Revision B (January 2022)

  • Changed TMP114N orderable status from Preview to Production DataGo
  • Added TMP114NA to Device Options tableGo
  • Removed preview note for TMP114NB and TMP114NCGo
  • Added TMP114NA to the Device Target Address tableGo

Changes from Revision * (June 2021) to Revision A (September 2021)

  • Added TMP114N orderable preview informationGo
  • Changed the data sheet status from Advanced Information to Production MixedGo
  • Added Device Options tableGo