SNIS214E june   2021  – july 2023 TMP114

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 1.2 V Compatible Logic Inputs
      2. 8.3.2 Cyclic Redundancy Check (CRC)
      3. 8.3.3 Temperature Limits
      4. 8.3.4 Slew Rate Warning
      5. 8.3.5 NIST Traceability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
        1. 8.4.2.1 One-Shot Temperature Conversions
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 I2C and SMBus Interface
      3. 8.5.3 Device Address
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Auto-Increment
        2. 8.5.4.2 Writes
          1. 8.5.4.2.1 CRC Enabled Writes
        3. 8.5.4.3 Reads
          1. 8.5.4.3.1 CRC Enabled Reads
        4. 8.5.4.4 General Call Reset Function
        5. 8.5.4.5 Time-Out Function
        6. 8.5.4.6 Coexist on I3C MixedBus
        7. 8.5.4.7 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Separate I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Equal I2C Pullup and Supply Voltage Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.3 Device Address

To communicate with the TMP114, the controller must first address target devices through an address byte. The address byte has seven address bits and a read-write (R/W) bit that indicates the intent of executing a read or write operation. Table 8-2 shows the TMP114 available in multiple versions, each with a different target address.

Table 8-2 Device Target Address
Product Device Two-Wire Address
TMP114A 1001000
TMP114B 1001001
TMP114C 1001010

TMP114D

1001011

TMP114ND

1001100
TMP114NC 1001101
TMP114NB 1001110
TMP114NA 1001111