SNIS214E june 2021 – july 2023 TMP114
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TMP114 | UNIT | |
---|---|---|---|
YMT | |||
4 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 168.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 1.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 47.3 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.6 | °C/W |
ΨJB | Junction-to-board characterization parameter | 47.3 | °C/W |
RθJC(bot) | Junction-to-case (bot) thermal resistance | – | °C/W |
MT | Thermal mass | 0.16 | mJ/°C |