SLVSDW2B December   2018  – November 2020 TPS23755

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: DC-DC Controller Section
    6. 6.6 Electrical Characteristics: PoE and Control
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  CLS Classification
      2. 7.3.2  DEN Detection and Enable
      3. 7.3.3  Internal Pass MOSFET
      4. 7.3.4  DC-DC Controller Features
        1. 7.3.4.1 VCC, VB and Advanced PWM Startup
        2. 7.3.4.2 CS, Current Slope Compensation and Blanking
        3. 7.3.4.3 COMP, FB, CP and Opto-less Feedback
        4. 7.3.4.4 FRS Frequency Setting and Synchronization
        5. 7.3.4.5 Frequency Dithering for Spread Spectrum Applications
        6. 7.3.4.6 SST and Soft-Start of the Switcher
        7. 7.3.4.7 AUX_V, AUX_D and Secondary Adapter Or'ing
      5. 7.3.5  Internal Switching FET - DRAIN, RSNS, SRF and SRR
      6. 7.3.6  VPD Supply Voltage
      7. 7.3.7  VDD Supply Voltage
      8. 7.3.8  GND
      9. 7.3.9  VSS
      10. 7.3.10 Exposed Thermal PAD
    4. 7.4 Device Functional Modes
      1. 7.4.1 PoE Overview
      2. 7.4.2 Threshold Voltages
      3. 7.4.3 PoE Start-Up Sequence
      4. 7.4.4 Detection
      5. 7.4.5 Hardware Classification
      6. 7.4.6 Maintain Power Signature (MPS)
      7. 7.4.7 Start-Up and Converter Operation
      8. 7.4.8 PD Self-Protection
      9. 7.4.9 Adapter ORing
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Input Bridges and Schottky Diodes
        2. 8.2.2.2  Protection, D1
        3. 8.2.2.3  Capacitor, C1
        4. 8.2.2.4  Detection Resistor, RDEN
        5. 8.2.2.5  Classification Resistor, RCLS
        6. 8.2.2.6  Bulk Capacitance, CBULK
        7. 8.2.2.7  Output Voltage Feedback Divider, RAUX, R1,R2
        8. 8.2.2.8  Setting Frequency, RFRS
        9. 8.2.2.9  Frequency Dithering, RDTR and CDTR
        10. 8.2.2.10 Bias Voltage, CVB and DVB
        11. 8.2.2.11 Transformer design, T1
        12. 8.2.2.12 Current Sense Resistor, RCS
        13. 8.2.2.13 Current Slope Compensation, RS
        14. 8.2.2.14 Bias Supply Requirements, CCC, DCC
        15. 8.2.2.15 Switching Transformer Considerations, RVCC and CCC2
        16. 8.2.2.16 Primary FET Clamping, RCL, CCL, and DCL
        17. 8.2.2.17 Converter Output Capacitance, COUT
        18. 8.2.2.18 Secondary Output Diode Rectifier, DOUT
        19. 8.2.2.19 Slew rate control, RSRF and RSRR
        20. 8.2.2.20 Shutdown at Low Temperatures, DVDD and CVDD
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RJJ|23
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The TPS23755 IC’s layout footprint shown in the Example Board Layout should be strictly followed. The below list are key highlights for layout consideration around the TPS23755.

  • Pin 22 of the TPS23755 is omitted from the IC to ensure high voltage clearance from Pin 24 (DRAIN). Therefore, the Pin 22 footprint should be removed when laying out the TPS23755.
  • It is recommended having at least 8 vias (VSS) connecting the exposed thermal pad through a top layer plane (2 oz copper recommended) to a bottom VSS plane (2 oz. copper recommended) to help with thermal dissipation.
  • The Pin24 of the TPS23755 should be near the power transformer and the current sense resistor should be close to Pin 1 of the TPS23755 to minimize the primary loop.

The layout of the PoE front end should follow power and EMI or ESD best-practice guidelines. A basic set of recommendations includes:

  • Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer, diode bridges, TVS and 0.1-μF capacitor, and TPS23755 converter input bulk capacitor.
  • Make all leads as short as possible with wide power traces and paired signal and return.
  • No crossovers of signals from one part of the flow to another are allowed.
  • Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input voltage rails and between the input and an isolated converter output.
  • Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay copper fills in the power path.

The DC-to-DC converter layout benefits from basic rules such as:

  • Having at least 4 vias (VDD) near the power transformer pin connected to VDD through multiple layer planes to help with thermal dissipation of the power transformer.
  • Having at least 6 vias (secondary ground) near the power transformer pin connected to secondary ground through multiple layer planes to help with thermal dissipation of the power transformer.
  • Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses, which include the power semiconductors and magnetics.
  • Minimize the trace length of high current power semiconductors and magnetic components.
  • Where possible, use vertical pairing.
  • Use the ground plane for the switching currents carefully.
  • Keep the high-current and high-voltage switching away from low-level sensing circuits including those outside the power supply.
  • Maintain proper spacing around the high-voltage sections of the converter.