SLVSH72 December   2023 TPS281C100

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
    4. 8.4 Working Mode
    5. 8.5 Feature Description
      1. 8.5.1 Accurate Current Sense
        1. 8.5.1.1 High Accuracy Sense Mode
      2. 8.5.2 Programmable Current Limit
        1. 8.5.2.1 Short-Circuit and Overload Protection
        2. 8.5.2.2 Capacitive Charging
      3. 8.5.3 Inductive-Load Switching-Off Clamp
      4. 8.5.4 Inductive Load Demagnetization
      5. 8.5.5 Full Protections and Diagnostics
        1. 8.5.5.1 Open-Load Detection
        2. 8.5.5.2 Thermal Protection Behavior
        3. 8.5.5.3 Undervoltage Lockout (UVLO) Protection
        4. 8.5.5.4 Reverse Polarity Protection
        5. 8.5.5.5 Protection for MCU I/Os
        6. 8.5.5.6 Diagnostic Enable Function
        7. 8.5.5.7 Loss of Ground
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 IEC 61000-4-4 EFT
        2. 9.2.1.2 IEC 61000-4-5 Surge
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting RILIM
        2. 9.2.2.2 Selecting RSNS
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 EMC Considerations
      2. 9.4.2 Layout Example
        1. 9.4.2.1 PWP Layout Without a GND Network
        2. 9.4.2.2 PWP Layout With a GND Network
        3. 9.4.2.3 DNT Layout Without a GND Network
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNT|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Continuous supply voltage, VS with respect to IC GND: Version A, B –0.7 64 V
Continuous supply voltage, VOUT with respect to IC GND: Version A, B –60 64 V
Transient (< 100 µs) voltage at the supply pin, VS  with respect to IC GND: Version A, B –0.7 81 V
Enable pin voltage, VEN –1 6 V
OL_ON pin voltage,  VOL_ON –1 6 V
DIAG_EN pin voltage, VDIAG_EN –1 6 V
Sense pin voltage, VSNS –1 6 V
FAULT pin voltage, VFAULT –1 6 V
Reverse ground current, IGND VS < 0 V –50 mA
Maximum junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.