SLVSH72 December   2023 TPS281C100

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
    4. 8.4 Working Mode
    5. 8.5 Feature Description
      1. 8.5.1 Accurate Current Sense
        1. 8.5.1.1 High Accuracy Sense Mode
      2. 8.5.2 Programmable Current Limit
        1. 8.5.2.1 Short-Circuit and Overload Protection
        2. 8.5.2.2 Capacitive Charging
      3. 8.5.3 Inductive-Load Switching-Off Clamp
      4. 8.5.4 Inductive Load Demagnetization
      5. 8.5.5 Full Protections and Diagnostics
        1. 8.5.5.1 Open-Load Detection
        2. 8.5.5.2 Thermal Protection Behavior
        3. 8.5.5.3 Undervoltage Lockout (UVLO) Protection
        4. 8.5.5.4 Reverse Polarity Protection
        5. 8.5.5.5 Protection for MCU I/Os
        6. 8.5.5.6 Diagnostic Enable Function
        7. 8.5.5.7 Loss of Ground
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 IEC 61000-4-4 EFT
        2. 9.2.1.2 IEC 61000-4-5 Surge
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting RILIM
        2. 9.2.2.2 Selecting RSNS
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 EMC Considerations
      2. 9.4.2 Layout Example
        1. 9.4.2.1 PWP Layout Without a GND Network
        2. 9.4.2.2 PWP Layout With a GND Network
        3. 9.4.2.3 DNT Layout Without a GND Network
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNT|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2) TPS281C100x UNIT
DNT (WSON) PWP (HTSSOP)
12 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 36.9 TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.4 TBD °C/W
RθJB Junction-to-board thermal resistance 13.7 TBD °C/W
ψJT Junction-to-top characterization parameter 0.4 TBD °C/W
ψJB Junction-to-board characterization parameter 13.7 TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 TBD °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The thermal parameters are based on a 4-layer PCB according to the JESD51-5 and JESD51-7 standards.