SLVSDE4E march   2017  – june 2023 TPS61253A , TPS61253E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-up
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Current Limit Operation
      5. 8.3.5 Load Disconnection
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto PFM Mode
      2. 8.4.2 Forced PWM Mode
      3. 8.4.3 Ultrasonic Mode
      4. 8.4.4 Pass-Through Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Output Capacitor
        4. 9.2.2.4 Input Capacitor
        5. 9.2.2.5 Checking Loop Stability
        6. 9.2.2.6 Application Curves
      3. 9.2.3 System Examples
  11.   Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  13. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  14.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS61253xUNIT
YFF (DSBGA)
9 PINS
RθJAJunction-to-ambient thermal resistance 108.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance 1.2°C/W
RθJBJunction-to-board thermal resistance 28.8°C/W
ψJTJunction-to-top characterization parameter 0.6°C/W
ψJBJunction-to-board characterization parameter 28.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.