JAJSM95A May   2023  – December 2023 DRV8845

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Operating Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Motor Configurations
      2. 7.3.2 Stepper Control Logic
      3. 7.3.3 DC Motor Control
      4. 7.3.4 PWM Current Control
      5. 7.3.5 Current Regulation and Decay Mode
      6. 7.3.6 Blanking Time
      7. 7.3.7 Charge Pump
      8. 7.3.8 Logic-Level Pin Diagram
      9. 7.3.9 Protection Circuits
        1. 7.3.9.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.9.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.9.3 Overcurrent Protection (OCP)
        4. 7.3.9.4 Thermal Shutdown (OTSD)
        5. 7.3.9.5 Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Operating Mode (nSLEEP = 1)
      3. 7.4.3 nSLEEP Reset Pulse
      4. 7.4.4 Functional Modes Summary
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Application Schematics
    3. 8.3 Application Curves
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Bulk Capacitance
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-20230127-SS0I-TMQP-PDLK-NC6MLZZJBBJP-low.svgFigure 5-1 RHH Package, 36-Pin QFN, Top View DRV8845
Table 5-1 Pin Functions
PINI/O(1)DESCRIPTION
NAMEQFN
I04

1

I

Control Input for H-Bridge 4

OUT1A

2

O

H-Bridge 1 Output A

SENSE1

3

O

Sense resistor terminal for H-Bridge 1

OUT1B

4

O

H-Bridge 1 Output B

VM1

5

P

Supply Voltage. VM1 should be connected to VM2 pin close to the device.

OUT2B

6

O

H-Bridge 2 Output B

SENSE2

7

O

Sense resistor terminal for H-Bridge 2

OUT2A

8

O

H-Bridge 2 Output A

PHASE4

9

I

Control Input for H-Bridge 4. Leave this pin OPEN when H-Bridge 3 and H-Bridge 4 are paralleled.

PHASE3

10

I

Control Input for H-Bridge 3. When H-bridge 3 and 4 are paralleled, PHASE3 is used to control the combined H-bridge.

nSLEEP

11

I

Sleep mode input. Logic high to enable device; logic low to enter low-power sleep mode; internal pulldown resistor.

VREF1

12

I

Reference voltage input to set the full scale chopping current in H-bridge 1

VREF2

13

I

Reference voltage input to set the full scale chopping current in H-bridge 2

VREF3

14

I

Reference voltage input to set the full scale chopping current in H-bridge 3. VREF3 controls the current of the combined bridge when H-Bridge 3 and H-Bridge 4 are paralleled.

VREF4

15

I

Reference voltage input to set the full scale chopping current in H-bridge 4. Voltage on this pin is ignored when H-Bridge 3 and H-Bridge 4 are paralleled.

GND

16

G

Analog ground

PHASE2

17

I

Control Input for H-Bridge 2

PHASE1

18

I

Control Input for H-Bridge 1

I14

19

I

Control Input for H-Bridge 4

OUT4A

20

O

H-Bridge 4 Output A

SENSE4

21

O

Sense resistor terminal for H-Bridge 4

OUT4B

22

O

H-Bridge 4 Output B

VM2

23

P

Supply Voltage. VM2 should be connected to VM1 pin close to the device.

OUT3B

24

O

H-Bridge 3 Output B

SENSE3

25

O

Sense resistor terminal for H-Bridge 3

OUT3A

26

O

H-Bridge 3 Output A

I13

27

I

Control Input for H-Bridge 3. When H-bridge 3 and 4 are paralleled, I13 is used to control the combined H-bridge.

I12

28

I

Control Input for H-Bridge 2

I11

29

I

Control Input for H-Bridge 1

PGND

30

G

Power ground

VCP

31

P

Reservoir capacitor terminal

CP1

32

P

Charge pump capacitor terminal

CP2

33

P

Charge pump capacitor terminal

I01

34

I

Control Input for H-Bridge 1

I02

35

I

Control Input for H-Bridge 2

I03

36

I

Control Input for H-Bridge 3. When H-bridge 3 and 4 are paralleled, I03 is used to control the combined H-bridge.

PAD

-

-

Exposed pad for enhanced thermal performance. Should be soldered to the PCB.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.