SNAS847 November   2023 LMK3H0102

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Specification
  7. 6 Differential Voltage Measurement Terminology
  8. 7 Parameter Measurement Information
    1. 7.1 Output Format Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Block-Level Description
      2. 8.3.2 Device Configuration Control
      3. 8.3.3 OTP Mode
      4. 8.3.4 I2C Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Inputs
      2. 8.4.2 Fractional Output Dividers
        1. 8.4.2.1 FOD Operation
        2. 8.4.2.2 Edge Combiner
        3. 8.4.2.3 Digital State Machine
        4. 8.4.2.4 Spread-Spectrum Clocking
        5. 8.4.2.5 Integer Boundary Spurs
      3. 8.4.3 Output Behavior
        1. 8.4.3.1 Output Format Selection
          1. 8.4.3.1.1 Output Format Types
            1. 8.4.3.1.1.1 LP-HCSL Termination
        2. 8.4.3.2 Output Slew Rate Control
        3. 8.4.3.3 REF_CTRL Operation
      4. 8.4.4 Output Enable
        1. 8.4.4.1 Output Enable Control
        2. 8.4.4.2 Output Enable Polarity
        3. 8.4.4.3 Individual Output Enable
        4. 8.4.4.4 Output Disable Behavior
      5. 8.4.5 Device Default Settings
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Interface
      2. 8.5.2 One-Time Programming Sequence
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Application Block Diagram Examples
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Example: Changing Output Frequency
      5. 9.2.5 Crosstalk
      6. 9.2.6 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Up Sequencing
      2. 9.3.2 Decoupling Power Supply Inputs
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device Registers
    1. 10.1 Register Maps
      1. 10.1.1  R0 Register (Address = 0x0) [reset = 0x0861]
      2. 10.1.2  R1 Register (Address = 0x1) [reset = 0x5599]
      3. 10.1.3  R2 Register (Address = 0x2) [reset = 0xC28F]
      4. 10.1.4  R3 Register (Address = 0x3) [reset = 0x1801]
      5. 10.1.5  R4 Register (Address = 0x4) [reset = 0x0000]
      6. 10.1.6  R5 Register (Address = 0x5) [reset = 0x0000]
      7. 10.1.7  R6 Register (Address = 0x6) [reset = 0x2AA0]
      8. 10.1.8  R7 Register (Address = 0x7) [reset = 0x6503]
      9. 10.1.9  R8 Register (Address = 0x8) [reset = 0xC28F]
      10. 10.1.10 R9 Register (Address = 0x9) [reset = 0x0066]
      11. 10.1.11 R10 Register (Address = 0xA) [reset = 0x0010]
      12. 10.1.12 R11 Register (Address = 0xB) [reset = 0x0000]
      13. 10.1.13 R12 Register (Address = 0xC) [reset = 0xE800]
      14. 10.1.14 R146 Register (Address = 0x92) [reset = 0x0000]
      15. 10.1.15 R147 Register (Address = 0x93) [reset = 0x0000]
      16. 10.1.16 R148 Register (Address = 0x94) [reset = 0x0000]
      17. 10.1.17 R238 Register (Address = 0xEE) [reset = 0x0000]
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RER|16
Thermal pad, mechanical data (Package|Pins)
Data Sheet

LMK3H0102 Reference-Less 2-Differential or 5-Single-Ended Output PCIe Gen 1-6 Compliant Programmable BAW Clock Generator