Processors

C6000TM Multicore DSP + Arm® SoC

Integrated DSP and Arm® cores providing system-level cost, power and area savings

TI DSP + Arm solutions are optimized for embedded systems with a focus on power savings and real-time performance, and include the OMAP-L1x and 66AK2x devices. OMAP-L1x devices are optimal for applications requiring efficient fixed and floating point processing and low power consumption.  The 66AK2x devices are optimal for high-performance applications and in addition, include OpenCL and OpenMP support for multicore homogeneous and heterogeneous programming.

C6000 Multicore performance range

Broad performance range

The C6000 DSP + Arm family offers scalability

  • DSP and Arm core speeds up to 1.2 GHz
  • Up to 200 GFLOPS of performance
  • Single and multicore Arm Cortex-A solutions
  • Single and multicore C6xx DSP solutions
C6000 DSP + Arm software

Software and integration

Software development kits and libraries to speed the development process

C6000 applications

Performance and power sensitive applications

Industrial and audio end equipment

C6000 DSP+Arm devices

OMAP-L138
66AK2G12
66AK2E05
66AK2L06
66AK2H14
# of cores (max frequency) Arm core(s) 1x Arm9 (456MHz) 1x Cortex -A15 (1GHz) 4x Cortex -A15 (1.4GHz) 2x Cortex -A15 (1.2GHz) 4x Cortex -A15 (1.4GHz)
DSP core(s) 1x C647x (456MHz) 1x C66x (1GHz) 1x C66x (1.4GHz) 4x C66x (1.2GHz) 8x C66x (1.2GHz)
# of cores (max frequency) DMIPS 456  3,500 19,600 8,400 19,600
GFLOPS 2.75  24 67.2 69.0 198.4
GMACS 3.65  32 44.8 153.6 307.2
Shared SRAM 128 KB 1 MB 2 MB 3 MB 6 MB
Ethernet 1x 10/100 1x 100/1000 8x 100/1000 4x 100/1000 4x 100/1000
10 Gigabit Ethernet                --                -- 2 lanes                -- 2 lanes
Serial Rapid I/O                --                --                --                -- Yes
Unique peripherals McASP

PRU-ICSS

McASP

Hyperlink

USB 3.0

JESD204B

DFE

FFT

Dual DDR-3 EMIF

Hyperlink

USB 3.0

Case temperature -40°C to 100°C -40°C to 125°C
-40°C to 100°C