Pushing power further
Your partner in power management
As your partner in power management, we are in constant pursuit of pushing the limits of power: developing new process, packaging and circuit-design technologies to deliver the best devices for your application. We’re committed to working alongside you to solve key power design challenges – increasing power density, extending battery life, reducing electromagnetic interference (EMI), enhancing power and signal integrity, and making systems even safer. It’s our mission to make more innovation possible for engineers everywhere. Watch this video to learn about how TI is pushing power further.
New power products
Explore our featured new products below. For more new power products, see our new products page.
Power design tools & simulation
Perform quick calculations and simulations to help you analyze and understand your design performance with our comprehensive power design tools.
Quickly create circuit simulations with the new PSpice® for TI design and simulation tool to select the right device for your design.
Power management is at the center of enabling the continued integration of electronics in our lives. For decades, TI has been at the forefront of developing new process, packaging and circuit-design technologies to deliver the best power devices for your design.
Whether it’s improving power density, extending battery life, reducing electromagnetic interference, preserving power and signal integrity, or maintaining safety in the presence of high voltages, we’re ready to work alongside you to address these key power-management challenges.
Power density: Achieve more power in smaller spaces, enhancing system functionality at reduced system costs
Board area and height are becoming limiting factors as power demands increase. Power designers must squeeze more circuitry into their applications to differentiate their products while also increasing efficiency and enhancing thermal performance. Higher power levels in smaller form factors are now possible using TI’s advanced process, packaging and circuit-design technologies.
Key benefits of TI technologies for power density include:
- Less heat: Achieve excellent device switching performance with our advanced silicon and gallium-nitride technologies.
- Improved thermal performance: Remove heat from the package with advanced cooling technologies, including enhanced HotRod™ QFN packaging, power wafer chip-scale packaging and top-side cooling.
- Increased efficiency: Use smaller passives while switching at higher frequencies – without sacrificing efficiency – with multilevel converter topologies and advanced power-stage gate drivers.
- Reduced system footprint: Save board space, simplify board layout and achieve low parasitics using advanced multichip module technologies.
Understanding the trade-offs and technologies to increase power density
Space is limited in power-supply designs, and engineers face constant pressure to do more with less. The need for improved power density is clear, but what limits designers from increasing power density today? In this white paper, we’ll examine the barriers in depth and provide technology examples to help you overcome them.
Understanding the fundamental technologies of power density
Watch this five-part training series, where we outline how to achieve higher power density by examining four critical aspects of high-power-density solutions, as well as relevant technologies and products supporting these specific requirements.
Low quiescent current (IQ): Extend battery & shelf life without compromising system performance
In battery-operated systems, the need to achieve high efficiency at no- or light-load conditions requires power solutions to tightly regulate the output while maintaining ultra-low supply current. With TI’s portfolio of ultra-low IQ technologies and products, you can maximize your battery run time and enable low power consumption in your next design.
Key benefits of TI technologies for low IQ include:
- Low, always-on power: Long battery run times, enabled by ultra-low leakage process technologies and novel control topologies.
- Fast response times: Fast wake-up comparators and zero-IQ feedback control enable fast dynamic responses without compromising low power consumption.
- Reduced form factor: Area reduction techniques for resistors and capacitors facilitate integration into space-constrained applications while not affecting quiescent power.
IQ: What it is, what it isn’t, and how to use it for low-power DC/DC converters
Quiescent current (IQ) is one of the most misunderstood parameters in low-power designs. This Analog Design Journal (ADJ) article explains what IQ is and isn’t, and offers design considerations for avoiding common IQ measurement errors.
Designing with low-IQ buck converters, LDOs and battery-management devices
Quiescent current is one of the most critical design concepts that every power-supply designer needs to master. Check out this training series to understand how IQ relates to buck converters, low-dropout (LDO) regulators and battery-management devices.
Low EMI: Lower system costs & quickly meet EMI standards by reducing emissions
Electromagnetic interference (EMI) is a key requirement of increasing importance in electronic systems, especially in new applications such as automotive and industrial applications. Designing for low EMI can save you significant development cycle times while also reducing board area and solution cost. TI offers multiple features and technologies to mitigate EMI in all of the frequency bands of interest.
Key benefits of TI technologies for low EMI include:
- Improved filter size and cost: Advanced spread-spectrum techniques reduce the impact of generated EMI.
- Reduced design time and complexity: Flip-chip packaging, capacitor integration and advanced gate-driver techniques fundamentally reduce generated noise at the source.
An overview of conducted EMI specifications for power supplies
The first step in EMI design is understanding the specifications that you need to meet. This white paper takes a close look at industry standards for conducted EMI, such as Comité International Spécial des Perturbations Radioélectriques (CISPR) 25 and European Standard (EN) 55022. To learn about radiated EMI, download the overview.
Designing a low EMI power supply
EMI design can be challenging, but we’re here to help. This comprehensive training series shows you an easier path to designing an efficient power supply that meets conducted and radiated EMI requirements.
Low noise & precision: Enhance power & signal integrity to improve system-level protection & accuracy
The ability to monitor, condition and process signals in the power chain is critical in order to maximize system performance and reliability. High-precision systems require accurate low-noise references, as well as supply rails with low noise and ripple. TI uses dedicated process components and advanced circuit and test techniques that increase accuracy and minimize distortion.
Key benefits of TI technologies for low noise and precision include:
- Improved accuracy and precision: Reduce and mitigate integrated circuit error sources with fundamentally low-noise process components, advanced integrated circuit designs and low-stress packaging.
- System noise mitigation: Manage noisy environments with high power-supply rejection ratio (PSRR) low-dropout regulators (LDOs), integrated filtering and remote sensing.
LDO noise demystified
Do you think of noise and power-supply rejection ratio (PSRR) as one and the same? Read this application note to learn how noise and PSRR differ from each other and explore approaches for reducing LDO noise in your designs.
LDO basics: PSRR
Watch this training video to understand the nuances of power-supply rejection ratio (PSRR), how to determine PSRR in your application, and what parameters and factors affect the PSRR value.
Isolation: Increase safety with the highest working voltage & reliability
Isolation is about reliable protection in the presence of dangerous high voltages. Galvanic isolation electrically separates two domains, allowing power or signals to transfer across the barrier without compromising human safety, while also preventing ground potential differences and improving noise immunity. TI’s portfolio of isolation technologies, including a capacitive SiO2 insulation barrier and integrated transformers, help exceed Verband der Automobilindustrie (VDA), Canadian Standards Association (CSA) and Underwriters Laboratory (UL) standards without compromising performance. To learn more about isolation, see all of our isolation solutions.
Key benefits of TI technologies for isolation include:
- Improved system robustness and reliability: TI’s portfolio of high-voltage isolated products achieves low latency, excellent common-mode transient immunity and robust performance.
- Improved form factors and simplified EMI compliance: TI’s isolation technologies help achieve best in-class size, thermals and EMI.
Enabling high-voltage quality and reliability
Want to learn more about our capacitor-based reinforced isolation for signaling? This white paper explores extensive data from device characterization to testing to show that the process and related devices meet or exceed specifications.
How high-voltage isolation technology works
TI’s capacitive isolation technology enables the industry’s highest isolation ratings and longest lifetime reliability. Discover the performance advantages of capacitive isolation from one of our high-voltage technology experts.