SLAS734G April 2011  – April 2016 MSP430G2203 , MSP430G2233 , MSP430G2303 , MSP430G2333 , MSP430G2403 , MSP430G2433 , MSP430G2533

PRODUCTION DATA. 

  1. 1Device Overview
    1. 1.1Features
    2. 1.2Applications
    3. 1.3Description
    4. 1.4Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Diagrams
    2. 4.2Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5 Typical Characteristics, Active Mode Supply Current (Into VCC)
    6. 5.6 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7 Typical Characteristics, Low-Power Mode Supply Currents
    8. 5.8 Thermal Resistance Characteristics
    9. 5.9 Schmitt-Trigger Inputs, Ports Px
    10. 5.10Leakage Current, Ports Px
    11. 5.11Outputs, Ports Px
    12. 5.12Output Frequency, Ports Px
    13. 5.13Typical Characteristics - Outputs
    14. 5.14Pin-Oscillator Frequency - Ports Px
    15. 5.15Typical Characteristics - Pin-Oscillator Frequency
    16. 5.16POR, BOR
    17. 5.17Main DCO Characteristics
    18. 5.18DCO Frequency
    19. 5.19Calibrated DCO Frequencies, Tolerance
    20. 5.20Wake-up Times From Lower-Power Modes (LPM3, LPM4)
    21. 5.21Typical Characteristics, DCO Clock Wake-up Time From LPM3 or LPM4
    22. 5.22Crystal Oscillator, XT1, Low-Frequency Mode
    23. 5.23Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 5.24Timer_A
    25. 5.25USCI (UART Mode)
    26. 5.26USCI (SPI Master Mode)
    27. 5.27USCI (SPI Slave Mode)
    28. 5.28USCI (I2C Mode)
    29. 5.2910-Bit ADC, Power Supply and Input Range Conditions (MSP430G2x33 Only)
    30. 5.3010-Bit ADC, Built-In Voltage Reference (MSP430G2x33 Only)
    31. 5.3110-Bit ADC, External Reference (MSP430G2x33 Only)
    32. 5.3210-Bit ADC, Timing Parameters (MSP430G2x33 Only)
    33. 5.3310-Bit ADC, Linearity Parameters (MSP430G2x33 Only)
    34. 5.3410-Bit ADC, Temperature Sensor and Built-In VMID (MSP430G2x33 Only)
    35. 5.35Flash Memory
    36. 5.36RAM
    37. 5.37JTAG and Spy-Bi-Wire Interface
    38. 5.38JTAG Fuse
  6. 6Detailed Description
    1. 6.1 CPU
    2. 6.2 Instruction Set
    3. 6.3 Operating Modes
    4. 6.4 Interrupt Vector Addresses
    5. 6.5 Special Function Registers (SFRs)
    6. 6.6 Memory Organization
    7. 6.7 Bootloader (BSL)
    8. 6.8 Flash Memory
    9. 6.9 Peripherals
      1. 6.9.1Oscillator and System Clock
      2. 6.9.2Calibration Data Stored in Information Memory Segment A
      3. 6.9.3Brownout
      4. 6.9.4Digital I/O
      5. 6.9.5WDT+ Watchdog Timer
      6. 6.9.6Timer_A3 (TA0, TA1)
      7. 6.9.7Universal Serial Communications Interface (USCI)
      8. 6.9.8ADC10 (MSP430G2x33 Only)
      9. 6.9.9Peripheral File Map
    10. 6.10I/O Port Diagrams
      1. 6.10.1Port P1 Pin Diagram: P1.0 to P1.2, Input/Output With Schmitt Trigger
      2. 6.10.2Port P1 Pin Diagram: P1.3, Input/Output With Schmitt Trigger
      3. 6.10.3Port P1 Pin Diagram: P1.4, Input/Output With Schmitt Trigger
      4. 6.10.4Port P1 Pin Diagram: P1.5 to P1.7, Input/Output With Schmitt Trigger
      5. 6.10.5Port P2 Pin Diagram: P2.0 to P2.5, Input/Output With Schmitt Trigger
      6. 6.10.6Port P2 Pin Diagram: P2.6, Input/Output With Schmitt Trigger
      7. 6.10.7Port P2 Pin Diagram: P2.7, Input/Output With Schmitt Trigger
      8. 6.10.8Port P3 Pin Diagram: P3.0 to P3.7, Input/Output With Schmitt Trigger (RHB and PW28 Package Only)
  7. 7Device and Documentation Support
    1. 7.1Getting Started and Next Steps
    2. 7.2Device Nomenclature
    3. 7.3Tools and Software
    4. 7.4Documentation Support
    5. 7.5Related Links
    6. 7.6Community Resources
    7. 7.7Trademarks
    8. 7.8Electrostatic Discharge Caution
    9. 7.9Glossary
  8. 8Mechanical, Packaging, and Orderable Information

7 Device and Documentation Support

7.1 Getting Started and Next Steps

For more information on the MSP430™ family of devices and the tools and libraries that are available to help with your development, visit the Getting Started page.

7.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of three prefixes: MSP, PMS, or XMS (for example, MSP430F5438A). TI recommends two of three possible prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully qualified production devices and tools (with MSP for devices and MSP for tools).

Device development evolutionary flow:

XMS – Experimental device that is not necessarily representative of the electrical specifications for the final device

PMS – Final silicon die that conforms to the electrical specifications for the device but has not completed quality and reliability verification

MSP – Fully qualified production device

Support tool development evolutionary flow:

MSPX – Development-support product that has not yet completed TI's internal qualification testing.

MSP – Fully-qualified development-support product

XMS and PMS devices and MSPX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices and MSP development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend for reading the complete device name for any family member.

MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303 MSP430G2203 Part_Number_Decoder_MSP430.gif Figure 7-1 Device Nomenclature

7.3 Tools and Software

All MSP microcontrollers are supported by a wide variety of software and hardware development tools. Tools are available from TI and various third parties. See them all at MSP Tools.

Table 7-1 lists the debug features of these devices. See the Code Composer Studio for MSP430 User's Guide (SLAU157) for details on the available features.

Table 7-1 Hardware Features

MSP430 ARCHITECTURE 4-WIRE JTAG2-WIRE JTAGBREAK- POINTS
(N)
RANGE BREAK- POINTSCLOCK CONTROLSTATE SEQUENCERTRACE BUFFERLPMx.5 DEBUGGING SUPPORT
MSP430YesYes2NoYesNoNoNo

Design Kits and Evaluation Modules

    28-Pin Target Development Board and MSP-FET USB Programmer Bundle for MSP430F2x and MSP430G2x MCUs The MSP-FET430U28A kit includes all of the hardware and software required to quickly begin application development on the MSP430 MCU. This kit includes a ZIF socket target board (MSP-TS430PW28A) that accepts some MSP430 devices in 20- or 28-pin TSSOP packages (TI Package Code: PW). It is also bundled with a USB flash emulation tool (MSP-FET) that interfaces the target board to a PC, allowing developers to program and debug their MSP430 devices through in-system emulation through the JTAG interface or the pin-saving Spy Bi-Wire (2-wire JTAG) protocol.
    MSP430 LaunchPad™ Value Line Development Kit The MSP-EXP430G2 LaunchPad Development Kit is an easy-to-use microcontroller development board for the low-power and low-cost MSP430G2x MCUs. It has on-board emulation for programming and debugging and features a 14- or 20-pin DIP socket, on-board buttons and LEDs and BoosterPack Plug-in Module pinouts that support a wide range of modules for added functionality such as wireless, displays, and more.
    MSP430 Capacitive Touch BoosterPack™ Plug-in Module The Capacitive Touch BoosterPack (430BOOST-SENSE1) is a plug-in module for MCU LaunchPad Development Kits. This BoosterPack also includes a preprogrammed MSP430G2452IN20 Value Line device for the MSP-EXP430G2 LaunchPad. Developers can use this BoosterPack as a solution for adding capacitive touch differentiation in many applications such as consumer electronics, point of sales machines, and other devices with a physical button.

Software

    MSPWare™ Software MSPWare software is a collection of code examples, data sheets, and other design resources for all MSP devices delivered in a convenient package. In addition to providing a complete collection of existing MSP design resources, MSPWare software also includes a high-level API called MSP Driver Library. This library makes it easy to program MSP hardware. MSPWare software is available as a component of CCS or as a stand-alone package.
    MSP Driver Library Driver Library's abstracted API keeps you above the bits and bytes of the MSP430 hardware by providing easy-to-use function calls. Thorough documentation is delivered through a helpful API Guide, which includes details on each function call and the recognized parameters. Developers can use Driver Library functions to write complete projects with minimal overhead.
    Capacitive Touch Software Library Free C libraries for enabling capacitive touch capabilities on MSP430 MCUs and MSP432 MCUs. The MSP430 MCU version of the library features several capacitive touch implementations including the RO and RC method.
    MSP EnergyTrace™ Technology EnergyTrace technology for MSP430 microcontrollers is an energy-based code analysis tool that measures and displays the application’s energy profile and helps to optimize it for ultra-low-power consumption.
    ULP (Ultra-Low Power) Advisor ULP Advisor™ software is a tool for guiding developers to write more efficient code to fully utilize the unique ultra-low power features of MSP and MSP432 microcontrollers. Aimed at both experienced and new microcontroller developers, ULP Advisor checks your code against a thorough ULP checklist to squeeze every last nano amp out of your application. At build time, ULP Advisor will provide notifications and remarks to highlight areas of your code that can be further optimized for lower power.
    IEC60730 Software Package The IEC60730 MSP430 software package was developed to be useful in assisting customers in complying with IEC 60730-1:2010 (Automatic Electrical Controls for Household and Similar Use – Part 1: General Requirements) for up to Class B products, which includes home appliances, arc detectors, power converters, power tools, e-bikes, and many others. The IEC60730 MSP430 software package can be embedded in customer applications running on MSP430s to help simplify the customer’s certification efforts of functional safety-compliant consumer devices to IEC 60730-1:2010 Class B.
    Fixed-Point Math Library for MSP The MSP IQmath and Qmath Libraries are a collection of highly optimized and high-precision mathematical functions for C programmers to seamlessly port a floating-point algorithm into fixed-point code on MSP430 and MSP432 devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed, high accuracy, and ultra-low energy are critical. By using the IQmath and Qmath libraries, it is possible to achieve execution speeds considerably faster and energy consumption considerably lower than equivalent code written using floating-point math.

Development Tools

    Code Composer Studio™ Integrated Development Environment for MSP Microcontrollers Code Composer Studio is an integrated development environment (IDE) that supports all MSP microcontroller devices. Code Composer Studio comprises a suite of embedded software utilities used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar utilities and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers. When using CCS with an MSP MCU, a unique and powerful set of plugins and embedded software utilities are made available to fully leverage the MSP microcontroller.
    Grace – Graphical Peripheral Configuration Tool Enable and configure ADCs, DACs, timers, clocks, serial communication interfaces, and more, by interacting with buttons, drop-down menus, and text fields. Navigate through the MSP430 MCUs highly integrated peripheral set with ease.
    MSP Flasher - Command Line Programmer MSP Flasher is an open-source shell-based interface for programming MSP microcontrollers through a FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP Flasher can download binary files (.txt or .hex) files directly to the MSP microcontroller without an IDE.
    MSP MCU Programmer and Debugger The MSP-FET is a powerful emulation development tool – often called a debug probe – which allows users to quickly begin application development on MSP low-power microcontrollers (MCU). Creating MCU software usually requires downloading the resulting binary program to the MSP device for validation and debugging. The MSP-FET provides a debug communication pathway between a host computer and the target MSP. Furthermore, the MSP-FET also provides a Backchannel UART connection between the computer's USB interface and the MSP UART. This affords the MSP programmer a convenient method for communicating serially between the MSP and a terminal running on the computer. It also supports loading programs (often called firmware) to the MSP target using the BSL (bootloader) through the UART and I2C communication protocols.
    MSP-GANG Production Programmer The MSP Gang Programmer is an MSP430 or MSP432 device programmer that can program up to eight identical MSP430 or MSP432 Flash or FRAM devices at the same time. The MSP Gang Programmer connects to a host PC using a standard RS-232 or USB connection and provides flexible programming options that allow the user to fully customize the process. The MSP Gang Programmer is provided with an expansion board, called the Gang Splitter, that implements the interconnections between the MSP Gang Programmer and multiple target devices. Eight cables are provided that connect the expansion board to eight target devices (through JTAG or Spy-Bi-Wire connectors). The programming can be done with a PC or as a stand-alone device. A PC-side graphical user interface is also available and is DLL-based.

7.4 Documentation Support

The following documents describe the MSP430G2x33 and MSP430G2x03 devices. Copies of these documents are available on the Internet at www.ti.com.

Receiving Notification of Document Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (for example, MSP430G2533). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

Errata

User's Guides

    Code Composer Studio v6.1 for MSP430 User's Guide This manual describes the use of TI Code Composer Studio IDE v6.1 (CCS v6.1) with the MSP430 ultra-low-power microcontrollers. This document applies only for the Windows version of the Code Composer Studio IDE. The Linux version is similar and, therefore, is not described separately.
    MSP430 Programming With the Bootloader (BSL) The MSP430 bootloader (BSL, formerly known as the bootstrap loader) allows users to communicate with embedded memory in the MSP430 microcontroller during the prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs found in some digital signal processors (DSPs) that automatically load program code (and data) from external memory to the internal memory of the DSP.
    MSP430 Programming Via the JTAG Interface This document describes the functions that are required to erase, program, and verify the memory module of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition, it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
    MSP430 Hardware Tools User's Guide This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.

Application Reports

    MSP430 32-kHz Crystal Oscillators Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout are given. The document also contains detailed information on the possible oscillator tests to ensure stable oscillator operation in mass production.
    MSP430 System-Level ESD Considerations System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low-power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs: (1) Component-level ESD testing and system-level ESD testing, their differences and why component-level ESD rating does not ensure system-level robustness. (2) General design guidelines for system-level ESD protection at different levels including enclosures, cables, PCB layout, and on-board ESD protection devices. (3) Introduction to System Efficient ESD Design (SEED), a co-design methodology of on-board and on-chip ESD protection to achieve system-level ESD robustness, with example simulations and test results. A few real-world system-level ESD protection design examples and their results are also discussed.
    General Oversampling of MSP ADCs for Higher Resolution Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampling the ADC12 for Higher Resolution (SLAA323), therefore describes how an oversampling method can be incorporated to increase ADC resolution past the currently available number of bits.
    Capacitive Touch Hardware Design Guide Capacitive touch detection is sometimes considered more art than science. This often results in multiple design iterations before the optimum performance is achieved. There are, however, good design practices for circuit layout and principles of materials that need to be understood to keep the number of iterations to a minimum. This design guide describes a process for creating and designing capacitive touch solutions, starting with the schematic, working through the mechanicals, and finally designing the electrodes for the application.
    Capacitive Touch Sensing, MSP430 Slider and Wheel Tuning Guide This application report provides guidelines on how to tune capacitive touch sliders and wheels running on the MSP430™ microcontrollers. It identifies the hardware and software parameters as well as explains the steps used in tuning sliders and wheels. The slider and wheel tuning is based on the APIs defined in the Capacitive Touch Sense Library (CAPSENSELIBRARY).
    Capacitive Touch Sensing, MSP430 Button Gate Time Optimization and Tuning Guide MSP430™ microcontroller based capacitive touch buttons can offer increased performance when properly optimized and tuned for their specific application. Performance benefits that result from button optimization can include, but are not limited to, decreased power consumption, improved response time, and the ability to grow a design to include more buttons. This application report provides the reader with a starting point for button design at the system and software level.

7.5 Related Links

Table 7-2 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

7.6 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.7 Trademarks

MSP430, LaunchPad, BoosterPack, MSPWare, EnergyTrace, ULP Advisor, Code Composer Studio, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

7.8 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

7.9 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.