TLV755P 500-mA low-IQ small-size low-dropout (LDO) regulator | TI.com

TLV755P
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500-mA low-IQ small-size low-dropout (LDO) regulator

 

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  • TLV758P  -  500-mA, adjustable-output LDO regulator with wider input voltage range and lower dropout

Description

The TLV755P is an ultra-small, low quiescent current, low-dropout regulator (LDO) that sources 500 mA with good line and load transient performance. The TLV755P is optimized for a wide variety of applications by supporting an input voltage range from 1.45 V to 5.5 V. To minimize cost and solution size, the device is offered in fixed output voltages ranging from 0.6 V to 5 V to support the lower core voltages of modern microcontrollers (MCUs). Additionally, the TLV755P has a low IQ with enable functionality to minimize standby power. This device features an internal soft-start to lower inrush current, thus providing a controlled voltage to the load and minimizing the input voltage drop during start up. When shutdown, the device actively pulls down the output to quickly discharge the outputs and ensure a known start-up state.

The TLV755P is stable with small ceramic output capacitors allowing for a small overall solution size. A precision band-gap and error amplifier provides a typical accuracy of 1%. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout (UVLO). The TLV755P has an internal foldback current limit that helps reduce the thermal dissipation during short-circuit events.

Features

  • Input Voltage Range: 1.45 V to 5.5 V
  • Low IQ: 25 µA (Typical)
  • Low Dropout:
    • 238 mV (Maximum) at 500 mA (3.3 VOUT)
  • Output Accuracy: 1% (Maximum at 85°C)
  • Built-In Soft-Start With Monotonic VOUT Rise
  • Foldback Current Limit
  • Active Output Discharge
  • High PSRR: 46 dB at 100 kHz
  • Stable With a 1-µF Ceramic Output Capacitor
  • Packages:
    • 2.9-mm × 1.6-mm SOT-23-5
    • 1-mm x 1-mm X2SON-4
    • 2 mm × 2 mm WSON-6

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Thermal calculator

Estimate the LDO IC temperature at your design conditions:
Part number
    Range
Vin  V
Vout  V
Iout  A
Ambient temp  °C
Package option
Voltage option
PCB construction
Enhanced Thermal = single thermal spreading plane of 1 oz Cu
Minimum Thermal = single thermal spreading plane of 1/2 oz Cu
View the user guide for more details.

Junction temperature vs. PCB copper coverage area
These are estimated power dissipation and thermal results.
Care must be taken to ensure that device junction temperature
does not exeed the maximum ratings as indicated in the datasheet.

This calculator uses the PCB copper area to estimate the device junction temperature. See notes on usage and calculation method.

Parametrics

Compare all products in Linear regulators (LDO) Email Download to Excel
Part number Order Output options Iout (Max) (A) Vin (Max) (V) Vin (Min) (V) Vout (Max) (V) Vout (Min) (V) Fixed output options (V) Package Group Features Regulated outputs (#) Operating temperature range (C) Thermal resistance θJA (°C/W) Noise (uVrms) Approx. price (US$) Rating PSRR @ 100 KHz (dB) Accuracy (%) Dropout voltage (Vdo) (Typ) (mV) Iq (Typ) (mA) Package size: mm2:W x L (PKG)
TLV755P Order now Fixed Output     0.5     5.5     1.45     3.3     0.7     0.7
0.9
1
1.1
1.2
1.5
1.8
1.85
1.9
2.5
2.8
2.9
3.3    
SOT-23 | 5
WSON | 6
X2SON | 4    
Enable
Soft Start
Foldback Overcurrent Protection    
1     -40 to 125     100.2     60     0.19 | 1ku     Catalog     49     1.5     220     0.025     5SOT-23: 5 mm2: 1.6 x 2.9 (SOT-23 | 5)
6WSON: 4 mm2: 2 x 2 (WSON | 6)
4X2SON: 1 mm2: 1 x 1 (X2SON | 4)    
TLV757P Order now Fixed Output     1     5.5     1.45     4     0.7     0.9
1
1.2
1.5
1.8
1.9
2.5
2.8
2.9
3
3.3
4    
SOT-23 | 5
WSON | 6    
Enable
Soft Start
Foldback Overcurrent Protection    
1     -40 to 125     100.2     60     0.26 | 1ku     Catalog     45     1     425     0.025     5SOT-23: 5 mm2: 1.6 x 2.9 (SOT-23 | 5)
6WSON: 4 mm2: 2 x 2 (WSON | 6)