CSD88599Q5DC

활성

60V, N 채널 동기 벅 NexFET™ 전원 MOSFET, SON 5mm x 6mm Dual-Cool™ 전원 블록, 40A

제품 상세 정보

VDS (V) 60 VGS (V) 20 Type Power block Configuration PowerBlock ID - continuous drain current at TA=25°C (A) 40 Power loss (W) 3 Ploss current (A) 30 Features Motor control Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 60 VGS (V) 20 Type Power block Configuration PowerBlock ID - continuous drain current at TA=25°C (A) 40 Power loss (W) 3 Ploss current (A) 30 Features Motor control Rating Catalog Operating temperature range (°C) -55 to 150
VSON-CLIP (DMM) 22 30 mm² 6 x 5
  • Half-Bridge Power Block
  • High-Density SON 5-mm × 6-mm Footprint
  • Low RDS(ON) for Minimized Conduction Losses
    • 3.0-W PLoss at 30 A
  • DualCool™ Thermally Enhanced Package
  • Ultra-Low-Inductance Package
  • RoHS Compliant
  • Halogen Free
  • Lead-Free Terminal Plating
  • Half-Bridge Power Block
  • High-Density SON 5-mm × 6-mm Footprint
  • Low RDS(ON) for Minimized Conduction Losses
    • 3.0-W PLoss at 30 A
  • DualCool™ Thermally Enhanced Package
  • Ultra-Low-Inductance Package
  • RoHS Compliant
  • Halogen Free
  • Lead-Free Terminal Plating

The CSD88599Q5DC 60-V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5-mm × 6-mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.

The CSD88599Q5DC 60-V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5-mm × 6-mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.

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기술 문서

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모두 보기9
유형 직함 날짜
* Data sheet CSD88599Q5DC 60-V Half-Bridge NexFET Power Block datasheet (Rev. C) PDF | HTML 2018/04/18
Application note MOSFET Support and Training Tools (Rev. E) PDF | HTML 2024/05/13
Application note Semiconductor and IC Package Thermal Metrics (Rev. D) PDF | HTML 2024/03/25
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 2023/12/06
Application brief Tips for Successfully Paralleling Power MOSFETs PDF | HTML 2022/05/31
Technical article How to Select a MOSFET – Motor Control 2018/01/24
Technical article Improve the performance of your power tool design with power blocks PDF | HTML 2017/09/14
Technical article Demand for higher power density drives innovative power tool solution PDF | HTML 2017/05/23
Application note Ringing Reduction Techniques for NexFET High Performance MOSFETs 2011/11/16

설계 및 개발

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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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