CSD88599Q5DC
- Half-Bridge Power Block
- High-Density SON 5-mm × 6-mm Footprint
- Low RDS(ON) for Minimized Conduction Losses
- 3.0-W PLoss at 30 A
- DualCool™ Thermally Enhanced Package
- Ultra-Low-Inductance Package
- RoHS Compliant
- Halogen Free
- Lead-Free Terminal Plating
The CSD88599Q5DC 60-V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TIs stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5-mm × 6-mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.
기술 문서
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모두 보기9 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CSD88599Q5DC 60-V Half-Bridge NexFET Power Block datasheet (Rev. C) | PDF | HTML | 2018/04/18 |
Application note | MOSFET Support and Training Tools (Rev. E) | PDF | HTML | 2024/05/13 | |
Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 2024/03/25 | |
Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 2023/12/06 | |
Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | 2022/05/31 | |
Technical article | How to Select a MOSFET – Motor Control | 2018/01/24 | ||
Technical article | Improve the performance of your power tool design with power blocks | PDF | HTML | 2017/09/14 | |
Technical article | Demand for higher power density drives innovative power tool solution | PDF | HTML | 2017/05/23 | |
Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | 2011/11/16 |
설계 및 개발
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포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치
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