Lead-free conversion and logo

Small amounts of lead have been commonly used in integrated circuits for many years. During the late 1980s, TI began converting its products to lead-free alternatives.

Today, most TI's IC products meet the European Union (as well as other countries with these requirements) Restriction of Hazardous Substances (EU RoHS) thresholds for lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Some products require the use of exemptions when lead (Pb) exceeds the maximum 0.1% (1000ppm) EU RoHS threshold. The remaining products containing lead are for supporting customer needs that may be out of scope of EU RoHS, such as military or space. For more information on compliance status of specific TI part numbers visit our Material Content Search Tool.

Lead-free (Pb-free) logo

Since June 1, 2004, TI has shipped Pb-free capable IC components using packing labels that align with the Joint Electronic Device Engineering Council (JEDEC) standard J-STD-609. TI’s packing labels that use Pb-free logo indicates the product meets both the Pb-free finish requirements and uses a material set rated for lead-free reflow processes per J-STD-020 revision C or later.

Pb-free finish categories

JEDEC J-STD-609 Pb-free finish categories describing the lead-free (Pb-free) terminal finish/material of components and/or the solder paste/solder used in board assembly are:

  • e0 - contains intentionally added lead (Pb)
  • e1 - tin-silver-copper (SnAgCu) with silver content greater than 1.5% and no other intentionally added elements
  • e2- tin (Sn) alloys with no bismuth (Bi) nor zinc (Zn), excluding tin-silver-copper (SnAgCu) alloys in e1 and e8
  • e3 - tin (Sn)
  • e4 - precious metal (e.g., silver (Ag), gold (Au), nickel-palladium (NiPd), nickel-palladium-gold (NiPdAu) (no tin (Sn))
  • e5 - tin-zinc (SnZn), tin-zinc-other (SnZnX) (all other alloys containing tin (Sn) and zinc (Zn) and not containing bismuth (Bi))
  • e6 - contains bismuth (Bi)
  • e7 - low temperature solder (≤ 150 ºC) containing indium (In) [no bismuth (Bi)]
  • e8 - tin-silver-copper (SnAgCu) with silver content less than or equal to 1.5%, with or without intentionally added alloying elements. This category does not include any alloys described by e1 and e2 or containing bismuth or zinc in any quantity.
  • e9 - symbol - unassigned

An example of TI's JEDEC-compliant packing label with the J-STD-609 lead-free (Pb-free) logo and J-STD-020 MSL rating is in figure 1.


Figure 1: TI label with J-STD-609 symbolization

TI label with J-STD-609 symbolization

TI products that meet both the Pb-free requirements and industry-driven low halogen requirements have replaced the “e” symbol with a “G” on the labels as seen in figure 2. 

TI label with “Green” symbolization

Figure 2: TI label with “Green” symbolization

Further details of the chasing arrow symbol used on labels can be found here. Background information for the environmentally-friendly use period statement for products containing RoHS materials above the MCV and China RoHS can be found here.

RoHS status: Label symbolization

Lead-free EU logo

EU RoHS compliant product

This pertains to products that are fully EU RoHS and China RoHS compliant.

RoHS icon

EU RoHS compliant product

Product without the J-STD-0609 symbol but state "RoHS Exempt" and use the China RoHS chasing arrow symbol with a “50” is for product that has an EU RoHS exemption(s) applied. For TI products, this is for lead exceeding the 0.1% (1000ppm) threshold.

Non-EU RoHS compliant logo

Non EU RoHS compliant product

Product without the J-STD-060 symbol and use the China RoHS chasing arrow symbol with a “50” contain lead (Pb) above the 0.1% (1000ppm) threshold requirement and are not under EU RoHS exemption.

Other examples of TI labels and inclusion of Chasing Arrow symbol

TI products labeled as "Pb-free" or "green" are fully RoHS compliant to known regulations such as defined by the European Union, China and California. To meet China RoHS requirements, TI incorporated the chasing arrow symbol on product labels in July 2007. It further clarifies if TI products contain RoHS materials above the maximum concentrations value (MCV) or not. This symbol appears on the labels seen above as 2 chasing arrows with an “e” in the middle. For products that exceed any China RoHS substance thresholds, the “e” would be replaced by a “50” to meet the Chinese environmentally-friendly use period statement.

Additional details about the Chasing Arow symbol and the Pb-free symbols used on TI labels can be found here.  Background information for the Chinese environmentally-friendly use period statement for products containing China RoHS materials above the maximum concentration value (MCV) can be found here.

EU RoHS exemption usage

A few of TI's products are RoHS-compliant with the use of an EU RoHS exemption for lead, specifically:

  • 7(a): Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
  • 7(c)-I: Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors (e.g. piezoelectronic devices), or in a glass or ceramic matrix compound
  • 7(c) IV: Lead in PZT-based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
  • 15: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

TI's remaining products using lead are required by customers and out of scope of EU RoHS, such as military and space products. For more information on specific packages or part numbers visit our Material Content Search Tool or find links to related resources below.

J-STD-609 symbolization on TI IC products

Figure 3 contains examples of the J-STD-609 e-cat code along with an example of a product that also meets low halogen “G”-code requirements. These codes can only be used on products that are physically large enough for them to bear the appropriate markings.

J-STD-609 symbolization on TI IC products

Figure 3: Product symbolization