Due to worldwide environmental concerns, the need for lead-free devices in electronic components and systems continues to receive significant attention within the semiconductor and electronics industries.
TI is committed to working with customers to offer products that meet their specific needs in this area. Nickel/Palladium (Ni/Pd) finish, a lead-free alternative, was introduced to the IC market by TI in 1989. By 2000, these products moved to a Nickel/Palladium/Gold (Ni/Pd/Au).
Today TI's lead-free products use Ni/Pd/Au or annealed matte tin (Sn) for leadframe type packages and Tin/Silver/Copper (Sn/Ag/Cu) for ball grid array (BGA) types of products. All of these products meet the current European Union (EU) RoHS thresholds for lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs).
A few of TI's products are RoHS compliant with the use of an EU RoHS Exemption for lead, specifically:
- 7(a): Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
- 7(c)-I: Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors (e.g. piezoelectronic devices), or in a glass or ceramic matrix compound
- 7(c) IV: Lead in PZT-based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
- 15: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
TI's remaining products using lead are required by customers and out of scope of EU RoHS, such as military and space products. For more information on specific packages or part numbers visit our Material Content Search Tool or find links to related resources below.
- Lead-free conversion and logo
- China RoHS and Chasing Arrows
- Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount ICs (PDF, 302KB)
- Factors That Influence Side-Wetting Performance on IC Terminals (PDF, 683KB)
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF, 1.27MB)
- A Nickel-Palladium-Gold Lead Finish and Its Potential for Solder Joint Embrittlement (PDF, 401KB)
- Evaluation of Nickel/Palladium-Finished ICs with Lead-Free Solder Alloys (PDF, 279KB)
- MicroStar BGA Packaging Reference Guide (PDF, 1.34MB)
- Lead finish composition and Tin plating process
- Quality & reliability FAQs