Product shelf life FAQs

The product shelf life for semiconductor products is based on a number of factors, including the type of materials used in the device, manufacturing conditions, moisture sensitivity levels (MSL), the use of moisture barrier bags (MBBs) in product packaging, the amount of desiccant used and the customer storage conditions.

TI’s internal manufacturing processes are carefully controlled to deliver products with appropriate product shelf life performance.  Properly stored TI semiconductor components have a minimum product shelf life that meets or exceeds the applicable TI product warranty.

What is customer shelf life?

Customer shelf life refers to the amount of time that a TI semiconductor product can be safely stored at the customer without physical degradation that might subsequently impact manufacturing integrity.  Customer shelf life is expressed as the time between  delivery to the customer and use by the customer.  

What is internal manufacturing shelf life?

The internal manufacturing shelf life of TI products is the time from the date of product manufacture to the time the product is delivered to the customer.  Essentially, this is the time products are “in inventory” at TI. 

TI’s internal manufacturing processes are carefully controlled to deliver products with appropriate product shelf life performance.  While internal manufacturing shelf life controls vary by product, most TI products are approved for up to five years of internal manufacturing shelf life prior to shipment to the customer.

How does manufacturing date code affect customer shelf life?

Properly stored TI semiconductor components have a minimum useful customer shelf life that meets or exceeds the specified product warranty (generally one year from the date of delivery by TI or a TI authorized distributor unless otherwise specified).  As a result, the manufacturing date code does not affect minimum useful customer shelf life.  TI’s internal manufacturing processes are carefully controlled to deliver products with appropriate minimum customer shelf life performance.  

Is it OK to use older, out of warranty products that are past their minimum customer shelf life?

The exact product shelf life for a specific semiconductor product depends on a number of factors, including the type of materials used in the device, manufacturing conditions, moisture sensitivity levels (MSL), the use of moisture barrier bags (MBBs) in product packaging, the amount of desiccant used and the customer storage conditions.  As such, this is a decision that can only be made by the customer on a case by case basis.

Please refer to the paper entitled “Component Reliability After Long Term Storage,” which describes the risk factors associated with extended storage of plastic encapsulated integrated circuits in a warehouse (uncontrolled indoor environment) and the materials and practices required to assure the quality and reliability of the devices to the end user. 

What are TI’s internal guidelines related to product shelf life during manufacturing?

The internal manufacturing shelf life of TI products is the time from the date of product manufacture to the time the product is delivered by TI or a TI authorized distributor.  This internal manufacturing shelf life does not impact the minimum custom product shelf life enjoyed by the customer.  

Advancements in lead frame technology, packing materials, work methods and inventory logistics have made it possible to safely extend the internal manufacturing lead times of semiconductor products without compromising customer product shelf life.

TI’s internal manufacturing processes are carefully controlled to deliver products with appropriate product shelf life performance.  While internal manufacturing shelf life controls vary by product, most TI products are approved for up to five years of internal manufacturing shelf life prior to shipment to the customer.

TI has conducted extensive, long-term reliability studies regarding product shelf life.  For example, please see the paper entitled “Shelf-Life Evaluation of Lead-Free Component Finishes.”  These studies confirm there is no degradation of the products' electrical characteristics, and no product failures associated with TI’s  internal manufacturing shelf life storage practices.

What are the benefits to TI’s product shelf life approach?

Careful control of TI’s internal manufacturing processes allows TI deliver products with appropriate product shelf life performance.  This allows TI to manage inventory in a way that helps ensure continuity of supply to customers. With the TI warranty remaining intact, TI provides more immediate availability of products, and helps minimize burdens caused by end-of-life complications on mature products.

TI’s product shelf life approach benefits TI customers in multiple ways:

  • Improved assurance of supply
  • Improved product availability with reduced lead times
  • Improved handling of End-of-Life (EOL) commitments
  • Improved quality
  • Clarity of warranty

 

How can I best protect products during their shelf life?

Please continue to refer to the Moisture Sensitive Level (MSL) information on the bag or box for instruction on length of use. Your usage life remains unchanged.

Do I need to bake parts before using them in production?

In general, there is no need to bake properly-stored in-warranty parts before using them in the production line. However, if the Humidity Indicator Card (HIC) shows pink on >10 percent level then parts need baking before use. Actions are taken in TI’s Product Distribution Center (PDC) to ensure the moisture integrity of all material prior to shipment. For any material requiring repack the seal date on the material will indicate the date on which it was repacked.