SPRSP56F January   2021  – October 2023 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      12
      2.      13
    3. 6.3 Signal Descriptions
      1.      15
      2. 6.3.1  ADC
        1. 6.3.1.1 MAIN Domain
          1.        18
      3. 6.3.2  CPSW3G
        1. 6.3.2.1 MAIN Domain
          1.        21
          2.        22
          3.        23
      4. 6.3.3  CPTS
        1. 6.3.3.1 MAIN Domain
          1.        26
          2.        27
      5. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
          1.        30
      6. 6.3.5  ECAP
        1. 6.3.5.1 MAIN Domain
          1.        33
          2.        34
          3.        35
      7. 6.3.6  Emulation and Debug
        1. 6.3.6.1 MAIN Domain
          1.        38
        2. 6.3.6.2 MCU Domain
          1.        40
      8. 6.3.7  EPWM
        1. 6.3.7.1 MAIN Domain
          1.        43
          2.        44
          3.        45
          4.        46
          5.        47
          6.        48
          7.        49
          8.        50
          9.        51
          10.        52
      9. 6.3.8  EQEP
        1. 6.3.8.1 MAIN Domain
          1.        55
          2.        56
          3.        57
      10. 6.3.9  FSI
        1. 6.3.9.1 MAIN Domain
          1.        60
          2.        61
          3.        62
          4.        63
          5.        64
          6.        65
          7.        66
          8.        67
      11. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
          1.        70
          2.        71
        2. 6.3.10.2 MCU Domain
          1.        73
      12. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
          1.        76
      13. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
          1.        79
          2.        80
          3.        81
          4.        82
        2. 6.3.12.2 MCU Domain
          1.        84
          2.        85
      14. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
          1.        88
          2.        89
      15. 6.3.14 MCSPI
        1. 6.3.14.1 MAIN Domain
          1.        92
          2.        93
          3.        94
          4.        95
          5.        96
        2. 6.3.14.2 MCU Domain
          1.        98
          2.        99
      16. 6.3.15 MDIO
        1. 6.3.15.1 MAIN Domain
          1.        102
      17. 6.3.16 MMC
        1. 6.3.16.1 MAIN Domain
          1.        105
          2.        106
      18. 6.3.17 OSPI
        1. 6.3.17.1 MAIN Domain
          1.        109
      19. 6.3.18 Power Supply
        1.       111
      20. 6.3.19 PRU_ICSSG
        1. 6.3.19.1 MAIN Domain
          1.        114
          2.        115
      21. 6.3.20 Reserved
        1.       117
      22. 6.3.21 SERDES
        1. 6.3.21.1 MAIN Domain
          1.        120
      23. 6.3.22 System and Miscellaneous
        1. 6.3.22.1 Boot Mode Configuration
          1. 6.3.22.1.1 MAIN Domain
            1.         124
        2. 6.3.22.2 Clock
          1. 6.3.22.2.1 MCU Domain
            1.         127
        3. 6.3.22.3 System
          1. 6.3.22.3.1 MAIN Domain
            1.         130
          2. 6.3.22.3.2 MCU Domain
            1.         132
        4. 6.3.22.4 VMON
          1.        134
      24. 6.3.23 TIMER
        1. 6.3.23.1 MAIN Domain
          1.        137
        2. 6.3.23.2 MCU Domain
          1.        139
      25. 6.3.24 UART
        1. 6.3.24.1 MAIN Domain
          1.        142
          2.        143
          3.        144
          4.        145
          5.        146
          6.        147
          7.        148
        2. 6.3.24.2 MCU Domain
          1.        150
          2.        151
      26. 6.3.25 USB
        1. 6.3.25.1 MAIN Domain
          1.        154
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.7.4  eMMCPHY Electrical Characteristics
      5. 7.7.5  SDIO Electrical Characteristics
      6. 7.7.6  LVCMOS Electrical Characteristics
      7. 7.7.7  ADC12B Electrical Characteristics
      8. 7.7.8  USB2PHY Electrical Characteristics
      9. 7.7.9  SerDes PHY Electrical Characteristics
      10. 7.7.10 DDR Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Requirements
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Power Supply Sequencing
          1. 7.10.2.2.1 Power-Up Sequencing
          2. 7.10.2.2.2 Power-Down Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input Clocks / Oscillators
          1. 7.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.10.5 Peripherals
        1. 7.10.5.1  CPSW3G
          1. 7.10.5.1.1 CPSW3G MDIO Timing
          2. 7.10.5.1.2 CPSW3G RMII Timing
          3. 7.10.5.1.3 CPSW3G RGMII Timing
          4. 7.10.5.1.4 CPSW3G IOSETs
        2. 7.10.5.2  DDRSS
        3. 7.10.5.3  ECAP
        4. 7.10.5.4  EPWM
        5. 7.10.5.5  EQEP
        6. 7.10.5.6  FSI
        7. 7.10.5.7  GPIO
        8. 7.10.5.8  GPMC
          1. 7.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 7.10.5.8.4 GPMC0 IOSETs
        9. 7.10.5.9  I2C
        10. 7.10.5.10 MCAN
        11. 7.10.5.11 MCSPI
          1. 7.10.5.11.1 MCSPI — Controller Mode
          2. 7.10.5.11.2 MCSPI — Peripheral Mode
        12. 7.10.5.12 MMCSD
          1. 7.10.5.12.1 MMC0 - eMMC Interface
            1. 7.10.5.12.1.1 Legacy SDR Mode
            2. 7.10.5.12.1.2 High Speed SDR Mode
            3. 7.10.5.12.1.3 High Speed DDR Mode
            4. 7.10.5.12.1.4 HS200 Mode
          2. 7.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 7.10.5.12.2.1 Default Speed Mode
            2. 7.10.5.12.2.2 High Speed Mode
            3. 7.10.5.12.2.3 UHS–I SDR12 Mode
            4. 7.10.5.12.2.4 UHS–I SDR25 Mode
            5. 7.10.5.12.2.5 UHS–I SDR50 Mode
            6. 7.10.5.12.2.6 UHS–I DDR50 Mode
            7. 7.10.5.12.2.7 UHS–I SDR104 Mode
        13. 7.10.5.13 CPTS
        14. 7.10.5.14 OSPI
          1. 7.10.5.14.1 OSPI0 PHY Mode
            1. 7.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 7.10.5.14.1.2 OSPI0 Without Data Training
              1. 7.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 7.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 7.10.5.14.2 OSPI0 Tap Mode
            1. 7.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 7.10.5.15 PCIe
        16. 7.10.5.16 PRU_ICSSG
          1. 7.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 7.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 7.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 7.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 7.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 7.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 7.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 7.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 7.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 7.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 7.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 7.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 7.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 7.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 7.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 7.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 7.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 7.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 7.10.5.17 Timers
        18. 7.10.5.18 UART
        19. 7.10.5.19 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Arm Cortex-R5F Subsystem (R5FSS)
      3. 8.2.3 Arm Cortex-M4F (M4FSS)
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 8.4 Other Subsystems
      1. 8.4.1 PDMA Controller
      2. 8.4.2 Peripherals
        1. 8.4.2.1  ADC
        2. 8.4.2.2  DCC
        3. 8.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 8.4.2.4  ECAP
        5. 8.4.2.5  EPWM
        6. 8.4.2.6  ELM
        7. 8.4.2.7  ESM
        8. 8.4.2.8  GPIO
        9. 8.4.2.9  EQEP
        10. 8.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 8.4.2.11 I2C
        12. 8.4.2.12 MCAN
        13. 8.4.2.13 MCRC Controller
        14. 8.4.2.14 MCSPI
        15. 8.4.2.15 MMCSD
        16. 8.4.2.16 OSPI
        17. 8.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 8.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 8.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 8.4.2.20 Dual Mode Timer (DMTIMER)
        21. 8.4.2.21 UART
        22. 8.4.2.22 Universal Serial Bus Subsystem (USBSS)
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 DDR Board Design and Layout Guidelines
      2. 9.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.2.2 External Board Loopback
        3. 9.2.2.3 DQS (only available in Octal SPI devices)
      3. 9.2.3 USB VBUS Design Guidelines
      4. 9.2.4 System Power Supply Monitor Design Guidelines
      5. 9.2.5 High Speed Differential Signal Routing Guidance
      6. 9.2.6 Thermal Solution Guidance
    3. 9.3 Clock Routing Guidelines
      1. 9.3.1 Oscillator Routing
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information

The following list describes the contents of each column in Table 6-1, Pin Attributes:

  1. BALL NUMBER: Ball numbers assigned to each terminal of the Ball Grid Array package.
     
  2. BALL NAME: Ball name assigned to each terminal of the Ball Grid Array package (this name is typically taken from the primary MUXMODE 0 signal function).
     
  3. SIGNAL NAME: Signal name(s) of all dedicated and pin multiplexed signal functions associated with a ball.
    Note:

    Many device pins support multiple signal functions. Some signal functions are selected via a single layer of multiplexers associated with pins. Other signal functions are selected via two or more layers of multiplexers, where one layer is associated with the pins and other layers are associated with peripheral logic functions.

    Table 6-1, Pin Attributes only defines signal multiplexing at the pins. For more information, related to signal multiplexing at the pins, see the Pad Configuration Registers section in the Device Configuration chapter of the device TRM. For information associated with peripheral signal multiplexing, see the respective peripheral chapter in the device TRM.


  4. MUX MODE: The MUXMODE value associated with each pin multiplexed signal function:
    1. MUXMODE 0 is the primary pin multiplexed signal function. However, the primary pin multiplexed signal function is not necessarily the default pin multiplexed signal function.
      Note:

      The value found in the MUX MODE AFTER RESET column defines the default pin multiplexed signal function selected when MCU_PORz is deasserted.


    2. MUXMODE values 1 through 15 are possible for pin multiplexed signal functions. However, not all MUXMODE values have been implemented. The only valid MUXMODE values are those defined as pin multiplexed signal functions within the Pin Attributes table. Only valid values of MUXMODE should be used.
    3. Bootstrap defines SOC configuration pins, where the logic state applied to each pin is latched on the rising edge of PORz_OUT. These input signal functions are fixed to their respective pins and are not programmable via MUXMODE.
    4. An empty box means Not Applicable.
    Note:

    The following configurations of MUXMODE must be avoided for proper device operation.

    • Configuring multiple pins operating as inputs to the same pin multiplexed signal function is not supported as it can yield unexpected results.
    • Configuring a pin to an undefined pin multiplexing mode will cause the pin behavior to be undefined.


  5. TYPE: Signal type and direction:
    • I = Input
    • O = Output
    • OD = Output, with open-drain output function
    • IO = Input, Output, or simultaneously Input and Output
    • IOD = Input, Output, or simultaneously Input and Output, with open-drain output function
    • IOZ = Input, Output, or simultaneously Input and Output, with three-state output function
    • OZ = Output with three-state output function
    • A = Analog
    • PWR = Power
    • GND = Ground
    • CAP = LDO Capacitor.

  6. DSIS: The deselected input state (DSIS) indicates the state driven to the subsystem input (logic "0", logic "1", or "pad" level) when the pin multiplexed signal function is not selected by MUXMODE.
    • 0: Logic 0 driven to the subsystem input.
    • 1: Logic 1 driven to the subsystem input.
    • pad: Logic state of the pad is driven to the subsystem input.
    • An empty box means Not Applicable.

  7. BALL STATE DURING RESET RX/TX/PULL: State of the terminal while MCU_PORz is asserted, where RX defines the state of the input buffer, TX defines the state of the output buffer, and PULL defines the state of internal pull resistors:
    • RX (Input buffer)
      • Off: The input buffer is disabled.
      • On: The input buffer is enabled.
    • TX (Output buffer)
      • Off: The output buffer is disabled.
      • Low: The output buffer is enabled and drives VOL.
    • PULL (Internal pull resistors)
      • Off: Internal pull resistors are turned off.
      • Up: Internal pull-up resistor is turned on.
      • Down: Internal pull-down resistor is turned on.
      • NA: Not Applicable.
    • An empty box means Not Applicable.

  8. BALL STATE AFTER RESET RX/TX/PULL: State of the terminal after MCU_PORz is deasserted, where RX defines the state of the input buffer, TX defines the state of the output buffer, and PULL defines the state of internal pull resistors:
    • RX (Input buffer)
      • Off: The input buffer is disabled.
      • On: The input buffer is enabled.
    • TX (Output buffer)
      • Off: The output buffer is disabled.
      • SS: The subsystem selected with MUXMODE determines the output buffer state.
    • PULL (Internal pull resistors)
      • Off: Internal pull resistors are turned off.
      • Up: Internal pull-up resistor is turned on.
      • Down: Internal pull-down resistor is turned on.
      • NA: Not Applicable.
    • An empty box means Not Applicable.

  9. MUX MODE AFTER RESET: The value found in this column defines the default pin multiplexed signal function after MCU_PORz is deasserted.

    An empty box means Not Applicable.


  10. I/O OPERATING VOLTAGE: This column describes I/O operating voltage options of the respective power supply, when applicable.

    An empty box means Not Applicable.

    For more information, see valid operating voltage range(s) defined for each power supply in Section 7.4, Recommended Operating Conditions.


  11. POWER: The power supply of the associated I/O, when applicable.

    An empty box means Not Applicable.


  12. HYS: Indicates if the input buffer associated with this I/O has hysteresis:
    • Yes: With hysteresis
    • No: Without hysteresis
    • An empty box means Not Applicable.

    For more information, see the hysteresis values in Section 7.7, Electrical Characteristics.


  13. BUFFER TYPE: This column defines the buffer type associated with a terminal. This information can be used to determine which Electrical Characteristics table is applicable.

    An empty box means Not Applicable.

    For electrical characteristics, refer to the appropriate buffer type table in Section 7.7, Electrical Characteristics.


  14. PULL UP/DOWN TYPE: Indicates the presence of an internal pullup or pulldown resistor. Pullup and pulldown resistors can be enabled or disabled via software.
    • PU: Internal pull-up
    • PD: Internal pull-down
    • PU/PD: Internal pull-up and pull-down
    • An empty box means No internal pull.

  15. PADCONFIG Register:Name of the IO pad configuration register associated with Ball.
     
  16. PADCONFIG Address:Physical address of the IO pad configuration register associated with Ball.