SPRSP56F January   2021  – October 2023 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      12
      2.      13
    3. 6.3 Signal Descriptions
      1.      15
      2. 6.3.1  ADC
        1. 6.3.1.1 MAIN Domain
          1.        18
      3. 6.3.2  CPSW3G
        1. 6.3.2.1 MAIN Domain
          1.        21
          2.        22
          3.        23
      4. 6.3.3  CPTS
        1. 6.3.3.1 MAIN Domain
          1.        26
          2.        27
      5. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
          1.        30
      6. 6.3.5  ECAP
        1. 6.3.5.1 MAIN Domain
          1.        33
          2.        34
          3.        35
      7. 6.3.6  Emulation and Debug
        1. 6.3.6.1 MAIN Domain
          1.        38
        2. 6.3.6.2 MCU Domain
          1.        40
      8. 6.3.7  EPWM
        1. 6.3.7.1 MAIN Domain
          1.        43
          2.        44
          3.        45
          4.        46
          5.        47
          6.        48
          7.        49
          8.        50
          9.        51
          10.        52
      9. 6.3.8  EQEP
        1. 6.3.8.1 MAIN Domain
          1.        55
          2.        56
          3.        57
      10. 6.3.9  FSI
        1. 6.3.9.1 MAIN Domain
          1.        60
          2.        61
          3.        62
          4.        63
          5.        64
          6.        65
          7.        66
          8.        67
      11. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
          1.        70
          2.        71
        2. 6.3.10.2 MCU Domain
          1.        73
      12. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
          1.        76
      13. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
          1.        79
          2.        80
          3.        81
          4.        82
        2. 6.3.12.2 MCU Domain
          1.        84
          2.        85
      14. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
          1.        88
          2.        89
      15. 6.3.14 MCSPI
        1. 6.3.14.1 MAIN Domain
          1.        92
          2.        93
          3.        94
          4.        95
          5.        96
        2. 6.3.14.2 MCU Domain
          1.        98
          2.        99
      16. 6.3.15 MDIO
        1. 6.3.15.1 MAIN Domain
          1.        102
      17. 6.3.16 MMC
        1. 6.3.16.1 MAIN Domain
          1.        105
          2.        106
      18. 6.3.17 OSPI
        1. 6.3.17.1 MAIN Domain
          1.        109
      19. 6.3.18 Power Supply
        1.       111
      20. 6.3.19 PRU_ICSSG
        1. 6.3.19.1 MAIN Domain
          1.        114
          2.        115
      21. 6.3.20 Reserved
        1.       117
      22. 6.3.21 SERDES
        1. 6.3.21.1 MAIN Domain
          1.        120
      23. 6.3.22 System and Miscellaneous
        1. 6.3.22.1 Boot Mode Configuration
          1. 6.3.22.1.1 MAIN Domain
            1.         124
        2. 6.3.22.2 Clock
          1. 6.3.22.2.1 MCU Domain
            1.         127
        3. 6.3.22.3 System
          1. 6.3.22.3.1 MAIN Domain
            1.         130
          2. 6.3.22.3.2 MCU Domain
            1.         132
        4. 6.3.22.4 VMON
          1.        134
      24. 6.3.23 TIMER
        1. 6.3.23.1 MAIN Domain
          1.        137
        2. 6.3.23.2 MCU Domain
          1.        139
      25. 6.3.24 UART
        1. 6.3.24.1 MAIN Domain
          1.        142
          2.        143
          3.        144
          4.        145
          5.        146
          6.        147
          7.        148
        2. 6.3.24.2 MCU Domain
          1.        150
          2.        151
      26. 6.3.25 USB
        1. 6.3.25.1 MAIN Domain
          1.        154
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.7.4  eMMCPHY Electrical Characteristics
      5. 7.7.5  SDIO Electrical Characteristics
      6. 7.7.6  LVCMOS Electrical Characteristics
      7. 7.7.7  ADC12B Electrical Characteristics
      8. 7.7.8  USB2PHY Electrical Characteristics
      9. 7.7.9  SerDes PHY Electrical Characteristics
      10. 7.7.10 DDR Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Requirements
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Power Supply Sequencing
          1. 7.10.2.2.1 Power-Up Sequencing
          2. 7.10.2.2.2 Power-Down Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input Clocks / Oscillators
          1. 7.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.10.5 Peripherals
        1. 7.10.5.1  CPSW3G
          1. 7.10.5.1.1 CPSW3G MDIO Timing
          2. 7.10.5.1.2 CPSW3G RMII Timing
          3. 7.10.5.1.3 CPSW3G RGMII Timing
          4. 7.10.5.1.4 CPSW3G IOSETs
        2. 7.10.5.2  DDRSS
        3. 7.10.5.3  ECAP
        4. 7.10.5.4  EPWM
        5. 7.10.5.5  EQEP
        6. 7.10.5.6  FSI
        7. 7.10.5.7  GPIO
        8. 7.10.5.8  GPMC
          1. 7.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 7.10.5.8.4 GPMC0 IOSETs
        9. 7.10.5.9  I2C
        10. 7.10.5.10 MCAN
        11. 7.10.5.11 MCSPI
          1. 7.10.5.11.1 MCSPI — Controller Mode
          2. 7.10.5.11.2 MCSPI — Peripheral Mode
        12. 7.10.5.12 MMCSD
          1. 7.10.5.12.1 MMC0 - eMMC Interface
            1. 7.10.5.12.1.1 Legacy SDR Mode
            2. 7.10.5.12.1.2 High Speed SDR Mode
            3. 7.10.5.12.1.3 High Speed DDR Mode
            4. 7.10.5.12.1.4 HS200 Mode
          2. 7.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 7.10.5.12.2.1 Default Speed Mode
            2. 7.10.5.12.2.2 High Speed Mode
            3. 7.10.5.12.2.3 UHS–I SDR12 Mode
            4. 7.10.5.12.2.4 UHS–I SDR25 Mode
            5. 7.10.5.12.2.5 UHS–I SDR50 Mode
            6. 7.10.5.12.2.6 UHS–I DDR50 Mode
            7. 7.10.5.12.2.7 UHS–I SDR104 Mode
        13. 7.10.5.13 CPTS
        14. 7.10.5.14 OSPI
          1. 7.10.5.14.1 OSPI0 PHY Mode
            1. 7.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 7.10.5.14.1.2 OSPI0 Without Data Training
              1. 7.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 7.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 7.10.5.14.2 OSPI0 Tap Mode
            1. 7.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 7.10.5.15 PCIe
        16. 7.10.5.16 PRU_ICSSG
          1. 7.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 7.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 7.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 7.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 7.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 7.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 7.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 7.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 7.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 7.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 7.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 7.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 7.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 7.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 7.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 7.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 7.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 7.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 7.10.5.17 Timers
        18. 7.10.5.18 UART
        19. 7.10.5.19 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Arm Cortex-R5F Subsystem (R5FSS)
      3. 8.2.3 Arm Cortex-M4F (M4FSS)
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 8.4 Other Subsystems
      1. 8.4.1 PDMA Controller
      2. 8.4.2 Peripherals
        1. 8.4.2.1  ADC
        2. 8.4.2.2  DCC
        3. 8.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 8.4.2.4  ECAP
        5. 8.4.2.5  EPWM
        6. 8.4.2.6  ELM
        7. 8.4.2.7  ESM
        8. 8.4.2.8  GPIO
        9. 8.4.2.9  EQEP
        10. 8.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 8.4.2.11 I2C
        12. 8.4.2.12 MCAN
        13. 8.4.2.13 MCRC Controller
        14. 8.4.2.14 MCSPI
        15. 8.4.2.15 MMCSD
        16. 8.4.2.16 OSPI
        17. 8.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 8.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 8.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 8.4.2.20 Dual Mode Timer (DMTIMER)
        21. 8.4.2.21 UART
        22. 8.4.2.22 Universal Serial Bus Subsystem (USBSS)
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 DDR Board Design and Layout Guidelines
      2. 9.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.2.2 External Board Loopback
        3. 9.2.2.3 DQS (only available in Octal SPI devices)
      3. 9.2.3 USB VBUS Design Guidelines
      4. 9.2.4 System Power Supply Monitor Design Guidelines
      5. 9.2.5 High Speed Differential Signal Routing Guidance
      6. 9.2.6 Thermal Solution Guidance
    3. 9.3 Clock Routing Guidelines
      1. 9.3.1 Oscillator Routing
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
SUPPLY NAME DESCRIPTION MIN(1) NOM MAX(1) UNIT
VDD_CORE Core supply 0.75-V operation 0.715 0.75 0.79 V
0.85-V operation 0.81 0.85 0.895 V
VDDR_CORE RAM supply 0.81 0.85 0.895 V
VDD_MMC0(2) MMC0 PHY core supply 0.81 0.85 0.895 V
VDD_DLL_MMC0(2) MMC0 PLL analog supply 0.81 0.85 0.895 V
VDDA_0P85_SERDES0 SERDES0 0.85 V analog supply 0.81 0.85 0.895 V
VDDA_0P85_SERDES0_C SERDES0 clock 0.85 V analog supply 0.81 0.85 0.895 V
VDDA_0P85_USB0 USB0 0.85 V analog supply 0.81 0.85 0.895 V
VDDS_DDR(3)
VDDS_DDR_C(3)		 DDR PHY IO supply
DDR clock IO supply		 1.1-V operation 1.06 1.1 1.17 V
1.2-V operation 1.14 1.2 1.26 V
VDDS_MMC0 MMC0 PHY IO supply 1.71 1.8 1.89 V
VDDS_OSC MCU_OSC0 supply 1.71 1.8 1.89 V
VDDA_MCU POR and MCU PLL analog supply 1.71 1.8 1.89 V
VDDA_ADC0 ADC0 analog supply 1.71 1.8 1.89 V
VDDA_PLL0 Main, PER and R5F PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL1 ARM and DDR PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL2 PER0 PLL analog supply 1.71 1.8 1.89 V
VDDA_1P8_SERDES0 SERDES0 1.8 V analog supply 1.71 1.8 1.89 V
VDDA_1P8_USB0 USB0 1.8 V analog supply 1.71 1.8 1.89 V
VDDA_TEMP0 TEMP0 analog supply 1.71 1.8 1.89 V
VDDA_TEMP1 TEMP1 analog supply 1.71 1.8 1.89 V
VPP eFuse ROM programming supply 1.71 1.8 1.89 V
VMON_1P8_MCU Voltage monitor for 1.8 V MCU power supply 1.71 1.8 1.89 V
VMON_1P8_SOC Voltage monitor for 1.8 V SoC power supply 1.71 1.8 1.89 V
VDDA_3P3_USB0 USB0 3.3 V analog supply 3.135 3.3 3.465 V
VDDA_3P3_SDIO SDIO 3.3 V analog supply 3.135 3.3 3.465 V
VMON_3P3_MCU Voltage monitor for 3.3 V MCU power supply 3.135 3.3 3.465 V
VMON_3P3_SOC Voltage monitor for 3.3 V SoC power supply 3.135 3.3 3.465 V
VMON_VSYS Voltage monitor pin 0 see(4) 1 V
USB0_VBUS USB Level-shifted VBUS Input 0 see(5) 3.465 V
USB0_ID USB0 analog I/O for RID detection see(6) V
VDDSHV_MCU Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV0 Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV1 Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV2 Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV3 Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV4 Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV5 Dual-voltage IO supply 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
TJ Operating junction temperature range Automotive –40 125 °C
Extended Industrial –40 105
(1) The voltage at the device ball must never drop below the MIN voltage or rise above the MAX voltage for any amount of time during normal device operation.
(2) VDD_MMC0 and VDD_DLL_MMC0 must be connected to the same power source as VDD_CORE when MMC0 is not used. In this case, VDD_MMC0 and VDD_DLL_MMC0 may be operated at a nominal voltage of 0.75 or 0.85.
(3) VDDS_DDR and VDDS_DDR_C shall be sourced from the same power source.
(4) The VMON_VSYS pin provides a way to monitor the system power supply. For more information, see Section 9.2.4, System Power Supply Monitor Design Guidelines.
(5) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see Section 9.2.3, USB Design Guidelines.
(6) The USB0_ID pin is connected to analog circuits in the USB0 PHY. The analog circuits source a known current while measuring voltage, to determine the resistance value (RID), if connected to VSS through a resistor. This pin should be connected to VSS for USB host operation, or left unconnected for USB device operation, and should never be connected to any external voltage source.