SBOS571C August   2011  – August 2018 BUF20800-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 General-call Reset and Power-up
      2. 7.3.2 Output Voltage
      3. 7.3.3 Output Latch
      4. 7.3.4 Programmable VCOM
      5. 7.3.5 REFH and REFL Input range
    4. 7.4 Device Functional Modes
      1. 7.4.1 Replacement of Traditional Gamma Buffer
      2. 7.4.2 Dynamic Gamma Control
    5. 7.5 Programming
      1. 7.5.1 Two-wire Bus Overview
      2. 7.5.2 Data Rates
      3. 7.5.3 Read/Write Operations
        1. 7.5.3.1 Writing
        2. 7.5.3.2 Reading
      4. 7.5.4 Register Maps
        1. 7.5.4.1 Addressing the BUF20800-Q1
      5. 7.5.5 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor Selection
        2. 8.2.2.2 REFH and REFL Voltage Settings
      3. 8.2.3 Application Curves
      4. 8.2.4 Configuration for 20 Gamma Channels
      5. 8.2.5 Configuration for 22 Gamma Channels
      6. 8.2.6 The BUF20800-Q1 in Industrial Applications
      7. 8.2.7 Total TI Panel Solution
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General PowerPAD Design Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (January 2018) to C Revision

  • Changed OUT1-9 high output swing MIN number from "17.7" to "17.6"Go
  • Added OUT1-9 high output swing for TA = +25°C"Go

Changes from A Revision (November 2017) to B Revision

  • Added INL spec over temperature.Go
  • Added R1 and R2 callouts and corrected capacitor '10mF' value to '10µF' in Typical Application ConfigurationGo

Changes from * Revision (August 2011) to A Revision

  • Reformat to new TI standard: Added Device Information table, Pin Configuration and Functions section, Specifications section, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed to "Code 978" from "Code 1023"Go
  • Changed to "Code 32" from "Code 00"Go
  • Added MAX value for "OUT 10-18 output swing : low " parameterGo