SWRS210H January   2018  – November 2020 CC1312R

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Timing and Switching Characteristics
      1. 8.20.1 Reset Timing
      2. 8.20.2 Wakeup Timing
      3. 8.20.3 Clock Specifications
        1. 8.20.3.1 48 MHz Clock Input (TCXO)
        2. 8.20.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.20.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.20.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.20.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.20.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.20.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.20.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.      
      5. 8.20.5 UART
        1. 8.20.5.1 UART Characteristics
    21. 8.21 Peripheral Characteristics
      1. 8.21.1 ADC
        1. 8.21.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.21.2 DAC
        1. 8.21.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.21.3 Temperature and Battery Monitor
        1. 8.21.3.1 Temperature Sensor
        2. 8.21.3.2 Battery Monitor
      4. 8.21.4 Comparators
        1. 8.21.4.1 Low-Power Clocked Comparator
        2. 8.21.4.2 Continuous Time Comparator
      5. 8.21.5 Current Source
        1. 8.21.5.1 Programmable Current Source
      6. 8.21.6 GPIO
        1. 8.21.6.1 GPIO DC Characteristics
    22. 8.22 Typical Characteristics
      1. 8.22.1 MCU Current
      2. 8.22.2 RX Current
      3. 8.22.3 TX Current
      4. 8.22.4 RX Performance
      5. 8.22.5 TX Performance
      6. 8.22.6 ADC Performance
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The SimpleLink™ CC1312R device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY®, Wi-SUN®, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Flexible Sub-1 GHz radio supporting industry standard frequency bands (315 MHz, 433 MHz, 868 MHz, 900 MHz, and more) to meet the industrial needs.
  • Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) including complete SimpleLink™ 15.4-Stack (Sub-1 GHz) solution.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.85 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 11 µA at 105°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1312R device is part of the SimpleLink™ MCU platform, which consists of
Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

Device Information
PART NUMBER(1) PACKAGE BODY SIZE (NOM)
CC1312R1F3RGZ VQFN (48) 7.00 mm × 7.00 mm
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website.