SWRS294F March   2023  – October 2025 CC3300 , CC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 System Diagram
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 6.8  BLE Performance: Receiver Characteristics
    9. 6.9  BLE Performance: Transmitter Characteristics
    10. 6.10 Current Consumption: WLAN Static Modes
    11. 6.11 Current Consumption: 2.4GHz WLAN Use Cases
    12. 6.12 Current Consumption: BLE Static Modes
    13. 6.13 Current Consumption: BLE Use Cases
    14. 6.14 Current Consumption: Device Modes
    15. 6.15 Timing and Switching Characteristics
      1. 6.15.1 Power Supply Sequencing
      2. 6.15.2 Clocking Specifications
        1. 6.15.2.1 Slow Clock Generated Internally
        2. 6.15.2.2 Slow Clock Using an External Oscillator
          1. 6.15.2.2.1 External Slow Clock Requirements
        3. 6.15.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.15.2.3.1 External Fast Clock XTAL Specifications
    16. 6.16 Interface Timing Characteristics
      1. 6.16.1 SDIO Timing Specifications
        1. 6.16.1.1 SDIO Timing Diagram—Default Speed
        2. 6.16.1.2 SDIO Timing Parameters: Default Speed
        3. 6.16.1.3 SDIO Timing Diagram—High Speed
        4. 6.16.1.4 SDIO Timing Parameters: High Speed
      2. 6.16.2 SPI Timing Specifications
        1. 6.16.2.1 SPI Timing Diagram
        2. 6.16.2.2 SPI Timing Parameters
      3. 6.16.3 UART 4-Wire Interface
        1. 6.16.3.1 UART Timing Diagram
        2. 6.16.3.2 UART Timing Parameters
  8. 7 Detailed Description
    1. 7.1 WLAN Features
    2. 7.2 Bluetooth Low Energy Features
  9. 8 Applications, Implementation, and Layout
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature Boilerplate
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Application Reports

    CC33xx Production Line GuideTexas Instruments™ provides many resources to assist users in quickly examining the functionality and performance of TI devices. This document provides the necessary information to guide the user in production line testing for CC33xx. The device's functions can be checked using tools and software provided by Texas Instruments. Performance testing is more involved as external equipment is required for a thorough examination.
    SimpleLink CC33xx Security FeaturesThis document describes the CC33xx security-related features, which are made available to vendors through an ecosystem that incorporates simple and concise APIs, tools, and documentation.

User's Guides

    CC33xx WLAN Features User's GuideThis document provides information about CC33xx family of devices and Wi-Fi® features, as well as TI proprietary enhancements. The document does not provide the complete application programming interface (API) set, but a high-level overview of the features.
    CC33xx Hardware Integration

    This document describes how to integrate the CC33xx into any system and the hardware requirements for this device. Layout and schematic considerations are listed here as well, which TI highly recommends following to achieve the device performance listed in this data sheet.