Product details

Processor External MCU, External MPU Type MCU or MPU attach Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (MBits) 50 Security FW authentication and anti-rollback protection, Networking security (WPA3), Secured host interface Features 802.11ax, AP, Bluetooth low energy, COEX, Multirole, STA Operating temperature range (°C) -40 to 105 Rating Catalog
Processor External MCU, External MPU Type MCU or MPU attach Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (MBits) 50 Security FW authentication and anti-rollback protection, Networking security (WPA3), Secured host interface Features 802.11ax, AP, Bluetooth low energy, COEX, Multirole, STA Operating temperature range (°C) -40 to 105 Rating Catalog
WQFN (RSB) 40 25 mm² 5 x 5

Key Features

  • Wi-Fi 6 (802.11ax)

  • Bluetooth low energy 5.3 in CC33x1 devices

  • Companion IC to any processor or MCU host capable of running a TCP/IP stack

  • Integrated 2.4-GHz PA for complete wireless solution with up to +20-dBm output power.

  • Operating temperature: -40°C to +105°C

  • Application throughput up to 50 Mbps

Extended Features

  • Wi-Fi 6
    • 2.4 GHz, 20 MHz, single spatial stream
    • MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
    • Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
    • Hardware-based encryption and decryption supporting WPA2 and WPA3
    • Excellent interoperability
    • Support for 4 bit SDIO or SPI host interfaces
  • Bluetooth Low Energy 5.3
    • LE Coded PHYs (Long Range), LE 2M PHY (High Speed) and Advertising Extension
    • Host controller interface (HCI) transport with option for UART or shared SDIO
  • Enhanced Security
    • Secured host interface
    • Firmware authentication
    • Anti-rollback protection
  • Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
  • Optional antenna diversity or selection
  • 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)
  • Power Management
    • V MAIN, V IO, V pp: 1.8 V
    • V PA: 3.0 V to 4.2 V
  • Clock Sources
    • 40-MHz XTAL fast clock
    • Internal LFOSC or external 32.768-kHz slow clock
  • Small Package Size
    • Easy to design with 40-pin, 5-mm x 5-mm quad flat noleaded (QFN) package, 0.4-mm pitch

Key Features

  • Wi-Fi 6 (802.11ax)

  • Bluetooth low energy 5.3 in CC33x1 devices

  • Companion IC to any processor or MCU host capable of running a TCP/IP stack

  • Integrated 2.4-GHz PA for complete wireless solution with up to +20-dBm output power.

  • Operating temperature: -40°C to +105°C

  • Application throughput up to 50 Mbps

Extended Features

  • Wi-Fi 6
    • 2.4 GHz, 20 MHz, single spatial stream
    • MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
    • Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
    • Hardware-based encryption and decryption supporting WPA2 and WPA3
    • Excellent interoperability
    • Support for 4 bit SDIO or SPI host interfaces
  • Bluetooth Low Energy 5.3
    • LE Coded PHYs (Long Range), LE 2M PHY (High Speed) and Advertising Extension
    • Host controller interface (HCI) transport with option for UART or shared SDIO
  • Enhanced Security
    • Secured host interface
    • Firmware authentication
    • Anti-rollback protection
  • Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
  • Optional antenna diversity or selection
  • 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)
  • Power Management
    • V MAIN, V IO, V pp: 1.8 V
    • V PA: 3.0 V to 4.2 V
  • Clock Sources
    • 40-MHz XTAL fast clock
    • Internal LFOSC or external 32.768-kHz slow clock
  • Small Package Size
    • Easy to design with 40-pin, 5-mm x 5-mm quad flat noleaded (QFN) package, 0.4-mm pitch

The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC33xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.3 devices. The CC3300 and CC3301 are the first devices in this pin to pin compatible family.

  • CC3300: A 2.4GHz Wi-Fi 6 companion IC.

  • CC3301: A 2.4GHz Wi-Fi 6 and Bluetooth low energy 5.3 companion IC.

The CC330x offers the latest standards from Wi-Fi and BLE while maintaining compatibility with Wi-Fi 4 (802.11 b/g/n) and Wi-Fi 5 (802.11ac). These CC330x are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC330x is based upon proven technology. These devices are ideal for use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, CC330x brings the efficiency of Wi-Fi 6 to embedded device applications for the internet of things (IoT), with a small PCB footprint and highly optimized bill of materials.

The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC33xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.3 devices. The CC3300 and CC3301 are the first devices in this pin to pin compatible family.

  • CC3300: A 2.4GHz Wi-Fi 6 companion IC.

  • CC3301: A 2.4GHz Wi-Fi 6 and Bluetooth low energy 5.3 companion IC.

The CC330x offers the latest standards from Wi-Fi and BLE while maintaining compatibility with Wi-Fi 4 (802.11 b/g/n) and Wi-Fi 5 (802.11ac). These CC330x are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC330x is based upon proven technology. These devices are ideal for use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, CC330x brings the efficiency of Wi-Fi 6 to embedded device applications for the internet of things (IoT), with a small PCB footprint and highly optimized bill of materials.

Download View video with transcript Video
Information

Request more information

The full data sheet, software, and other information are available. Request now

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 5
Type Title Date
* Data sheet CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC datasheet (Rev. A) PDF | HTML 24 Apr 2023
Technical article How little-known capabilities of Wi-Fi®︎ 6 help connect IoT devices with confidence 18 Apr 2023
Technical article Simplifying your multi-rail power application with one device 27 May 2015
Technical article Get the noise out of my IoT 17 Apr 2015
Technical article Building the Industrial Internet of Things 16 Apr 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

BP-CC3301 — SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy BoosterPack™ plug-in module

The SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy devices enable affordable, reliable and secure connectivity in embedded applications with a processor host running Linux® or an MCU host running RTOS. The CC3301 BoosterPack™ plug-in module (BP-CC3301) is a test and (...)

User guide: PDF | HTML
IDE, configuration, compiler or debugger

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

Supported products & hardware

Supported products & hardware

This design resource supports most products in these categories.

Check the product details page to verify support.

Products
Automotive mmWave radar sensors
AWR1243 76-GHz to 81-GHz high-performance automotive MMIC AWR1443 Single-chip 76-GHz to 81-GHz automotive radar sensor integrating MCU and hardware accelerator AWR1642 Single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP and MCU AWR1843 Single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP, MCU and radar accelerator AWR1843AOP Single-chip 76-GHz to 81-GHz automotive radar sensor integrating antenna on package, DSP and MCU AWR2243 76-GHz to 81-GHz automotive second-generation high-performance MMIC AWR2944 Automotive 2nd-generation, 76-GHz to 81-GHz, high-performance SoC for corner and long-range radar AWR6443 Single-chip 60-GHz to 64-GHz automotive radar sensor integrating MCU and radar accelerator AWR6843 Single-chip 60-GHz to 64-GHz automotive radar sensor integrating DSP, MCU and radar accelerator AWR6843AOP Single-chip 60-GHz to 64-GHz automotive radar sensor integrating antenna on package, DSP and MCU
Industrial mmWave radar sensors
IWR1443 Single-chip 76-GHz to 81-GHz mmWave sensor integrating MCU and hardware accelerator IWR1642 Single-chip 76-GHz to 81-GHz mmWave sensor integrating DSP and MCU IWR1843 Single-chip 76-GHz to 81-GHz industrial radar sensor integrating DSP, MCU and radar accelerator IWR6443 Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating MCU and hardware accelerator IWR6843 Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability IWR6843AOP Single-chip 60-GHz to 64-GHz intelligent mmWave sensor with integrated antenna on package (AoP)
Launch Download options
Package Pins Download
WQFN (RSB) 40 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos