SWRS294F March   2023  – October 2025 CC3300 , CC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 System Diagram
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 6.8  BLE Performance: Receiver Characteristics
    9. 6.9  BLE Performance: Transmitter Characteristics
    10. 6.10 Current Consumption: WLAN Static Modes
    11. 6.11 Current Consumption: 2.4GHz WLAN Use Cases
    12. 6.12 Current Consumption: BLE Static Modes
    13. 6.13 Current Consumption: BLE Use Cases
    14. 6.14 Current Consumption: Device Modes
    15. 6.15 Timing and Switching Characteristics
      1. 6.15.1 Power Supply Sequencing
      2. 6.15.2 Clocking Specifications
        1. 6.15.2.1 Slow Clock Generated Internally
        2. 6.15.2.2 Slow Clock Using an External Oscillator
          1. 6.15.2.2.1 External Slow Clock Requirements
        3. 6.15.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.15.2.3.1 External Fast Clock XTAL Specifications
    16. 6.16 Interface Timing Characteristics
      1. 6.16.1 SDIO Timing Specifications
        1. 6.16.1.1 SDIO Timing Diagram—Default Speed
        2. 6.16.1.2 SDIO Timing Parameters: Default Speed
        3. 6.16.1.3 SDIO Timing Diagram—High Speed
        4. 6.16.1.4 SDIO Timing Parameters: High Speed
      2. 6.16.2 SPI Timing Specifications
        1. 6.16.2.1 SPI Timing Diagram
        2. 6.16.2.2 SPI Timing Parameters
      3. 6.16.3 UART 4-Wire Interface
        1. 6.16.3.1 UART Timing Diagram
        2. 6.16.3.2 UART Timing Parameters
  8. 7 Detailed Description
    1. 7.1 WLAN Features
    2. 7.2 Bluetooth Low Energy Features
  9. 8 Applications, Implementation, and Layout
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature Boilerplate
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10 Current Consumption: WLAN Static Modes

All results are based on measurements taken using the RadioTool evaluation application (typ values are taken with nominal devices at room temp).
PARAMETER TEST CONDITIONS VMAIN VPA UNIT
TYP MAX TYP MAX
Continuous TX(1)
 1 DSSS TX Power = 20.5dBm 92 250 290(1) mA
6 OFDM TX Power = 20.2dBm 105 170(1)(2) 250 290(1)
54 OFDM TX Power = 17.4dBm 110 180
HT MCS0 TX Power = 20.2dBm 105 245
HT MCS7 TX Power = 17.4dBm 110 180
HE MCS0 TX Power = 20.2dBm 105 240
HE MCS7 TX Power = 17.3dBm 110 180
Continuous RX 62 0 mA
Continuous Listen (For Beacon) 55.5 0
(1) Peak current VPA can hit 340mA during device calibration.
Peak current VMAIN of 185mA including peripherals and internal CPU when operating up to 85°C. When ambient temperature is 105°C peak current can reach up to 235mA. 
(2) The maximum current listed for VMAIN is rated up to 85°C. When operating at 105°C the maximum current can reach up to 230mA. For more information please reference this application note https://www.ti.com/secureresources/CC33XX-THERMAL-GUIDELINES-NDA .