SWRS333A July   2025  – August 2025 CC3300MOD , CC3301MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  WLAN Performance: 2.4GHz Receiver Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Transmitter Power
    7. 6.7  BLE Performance: Receiver Characteristics
    8. 6.8  BLE Performance: Transmitter Characteristics
    9. 6.9  Current Consumption: WLAN Static Modes
    10. 6.10 Current Consumption: 2.4GHz WLAN Use Cases
    11. 6.11 Current Consumption: BLE Static Modes
    12. 6.12 Current Consumption: BLE Use Cases
    13. 6.13 Current Consumption: Device Modes
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram: Default Speed
        2. 6.15.1.2 SDIO Timing Diagram: High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Device Certification
    1. 7.1 FCC Certification and Statement
    2. 7.2 IC/ISED Certification and Statement
    3. 7.3 ETSI/CE
    4. 7.4 MIC Certification
    5. 7.5 Manual Information to the End User
    6. 7.6 Module Markings
      1. 7.6.1 Test Grades
  9. 8 Application Information
    1. 8.1 Typical Application—CC330xMOD Reference Design
    2. 8.2 Design Recommendations
      1. 8.2.1 General Layout Recommendations
      2. 8.2.2 CC330xMOD RF Layout Recommendations
      3. 8.2.3 Thermal Board Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature Boilerplate
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • MOZ|65
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 IC/ISED Certification and Statement

CAUTION:

IC RF Radiation Exposure Statement:

To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.

Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.

The CC330xMOD modules from TI are certified for IC as a single-modular transmitter. The CC330xMOD modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment.

This device complies with Industry Canada license-exempt RSS standards.

Operation is subject to the following two conditions:

  • This device may not cause interference.
  • This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.

L'exploitation est autorisée aux deux conditions suivantes:

  • L'appareil ne doit pas produire de brouillage
  • L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.