SWRS333A July   2025  – August 2025 CC3300MOD , CC3301MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  WLAN Performance: 2.4GHz Receiver Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Transmitter Power
    7. 6.7  BLE Performance: Receiver Characteristics
    8. 6.8  BLE Performance: Transmitter Characteristics
    9. 6.9  Current Consumption: WLAN Static Modes
    10. 6.10 Current Consumption: 2.4GHz WLAN Use Cases
    11. 6.11 Current Consumption: BLE Static Modes
    12. 6.12 Current Consumption: BLE Use Cases
    13. 6.13 Current Consumption: Device Modes
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram: Default Speed
        2. 6.15.1.2 SDIO Timing Diagram: High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Device Certification
    1. 7.1 FCC Certification and Statement
    2. 7.2 IC/ISED Certification and Statement
    3. 7.3 ETSI/CE
    4. 7.4 MIC Certification
    5. 7.5 Manual Information to the End User
    6. 7.6 Module Markings
      1. 7.6.1 Test Grades
  9. 8 Application Information
    1. 8.1 Typical Application—CC330xMOD Reference Design
    2. 8.2 Design Recommendations
      1. 8.2.1 General Layout Recommendations
      2. 8.2.2 CC330xMOD RF Layout Recommendations
      3. 8.2.3 Thermal Board Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature Boilerplate
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • MOZ|65
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETERPINSMINMAXUNIT
1V8_IN1.8V Supply53,54–0.52.1V
3V3_IN3.3V Supply37,38–0.54.2V
Input Voltage to all digital pins–0.51V8_IN + 0.5V
VPPVPP OTP Voltage19–0.52.1V
TAOperating Ambient Temperature–4085°C
TstgStorage temperature–40105°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.