SWRS333A July   2025  – August 2025 CC3300MOD , CC3301MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  WLAN Performance: 2.4GHz Receiver Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Transmitter Power
    7. 6.7  BLE Performance: Receiver Characteristics
    8. 6.8  BLE Performance: Transmitter Characteristics
    9. 6.9  Current Consumption: WLAN Static Modes
    10. 6.10 Current Consumption: 2.4GHz WLAN Use Cases
    11. 6.11 Current Consumption: BLE Static Modes
    12. 6.12 Current Consumption: BLE Use Cases
    13. 6.13 Current Consumption: Device Modes
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram: Default Speed
        2. 6.15.1.2 SDIO Timing Diagram: High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Device Certification
    1. 7.1 FCC Certification and Statement
    2. 7.2 IC/ISED Certification and Statement
    3. 7.3 ETSI/CE
    4. 7.4 MIC Certification
    5. 7.5 Manual Information to the End User
    6. 7.6 Module Markings
      1. 7.6.1 Test Grades
  9. 8 Application Information
    1. 8.1 Typical Application—CC330xMOD Reference Design
    2. 8.2 Design Recommendations
      1. 8.2.1 General Layout Recommendations
      2. 8.2.2 CC330xMOD RF Layout Recommendations
      3. 8.2.3 Thermal Board Recommendations
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Device Nomenclature Boilerplate
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • MOZ|65
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2 Device Nomenclature Boilerplate

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

Device development evolutionary flow:

    TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMS Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.