DLPS258 August   2025 DLP472NP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     12
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Switching Characteristics
    9. 5.8  Timing Requirements
    10.     17
    11. 5.9  System Mounting Interface Loads
    12.     19
    13. 5.10 Micromirror Array Physical Characteristics
    14. 5.11 Micromirror Array Optical Characteristics
    15.     22
    16. 5.12 Window Characteristics
    17. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 LPSDR Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Temperature Sensor Diode
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

DLP472NP LPSDR Switching Parameters
The low-speed interface is LPSDR and adheres to the Electrical Characteristics and AC/DC Operating Conditions table in JEDEC Standard No. 209B, Low Power Double Data Rate (LPDDR)JESD209B.
Figure 5-2 LPSDR Switching Parameters
DLP472NP LPSDR Input Rise and Fall Slew RateFigure 5-3 LPSDR Input Rise and Fall Slew Rate
DLP472NP SubLVDS Input Rise and Fall Slew RateFigure 5-4 SubLVDS Input Rise and Fall Slew Rate
DLP472NP Window Time Derating ConceptFigure 5-5 Window Time Derating Concept
DLP472NP SubLVDS Switching ParametersFigure 5-6 SubLVDS Switching Parameters
DLP472NP High-Speed Training Scan Window
Note: Refer to Section 5.8 for details.
Figure 5-7 High-Speed Training Scan Window
DLP472NP SubLVDS Voltage ParametersFigure 5-8 SubLVDS Voltage Parameters
DLP472NP SubLVDS Waveform ParametersFigure 5-9 SubLVDS Waveform Parameters
DLP472NP SubLVDS Equivalent Input CircuitFigure 5-10 SubLVDS Equivalent Input Circuit
DLP472NP LPSDR Input HysteresisFigure 5-11 LPSDR Input Hysteresis
DLP472NP LPSDR Read OutFigure 5-12 LPSDR Read Out
DLP472NP Test Load Circuit for Output Propagation Measurement
See Section 5.6 for more information.
Figure 5-13 Test Load Circuit for Output Propagation Measurement