DLPS210 March   2021 DLP651NE

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5.    
    6. 6.5  Thermal Information
    7. 6.6  Electrical Characteristics
    8. 6.7  Switching Characteristics
    9.    
    10. 6.8  Timing Requirements
    11.    
    12. 6.9  System Mounting Interface Loads
    13.    
    14. 6.10 Micromirror Array Physical Characteristics
    15.    
    16. 6.11 Micromirror Array Optical Characteristics
    17.    
    18. 6.12 Window Characteristics
    19. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Temperature Sensor Diode
  9. Power Supply Recommendations
    1. 9.1 Power Supply Sequence Requirements
    2. 9.2 DMD Power Supply Power-Up Procedure
    3. 9.3 DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Impedance Requirements
    3. 10.3 Layers
    4. 10.4 Trace Width, Spacing
    5. 10.5 Power
    6. 10.6 Trace Length Matching Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
  • FYP|149
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Impedance Requirements

TI recommends a target impedance for the PCB of 50 Ω ±10% for all signals. The exceptions are listed in Table 10-1.

Table 10-1 Special Impedance Requirements
Signal TypeSignal NameImpedance (ohms)
DMD High Speed Data SignalsDMD_HSSI0_N_(0…7),
DMD_HSSI0_P_(0…7),
DMD_HSSI1_N_(0…7),
DMD_HSSI1_P_(0…7),
DMD_HSSI0_CLK_N,
DMD_HSSI0_CLK_P,
DMD_HSSI1_CLK_N,
DMD_HSSI1_CLK_P
100 ohm differential (50 ohm single ended)
DMD Low Speed Interface SignalsDMD_LS0_WDATA_N,
DMD_LS0_WDATA_P,
DMD_LS0_CLK_N,
DMD_LS0_CLK_P
100 ohm differential (50 ohm single ended)