DLPS029F April   2013  – May 2019 DLPC350

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. Table 1. Power and Ground Pin Descriptions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  I/O Electrical Characteristics
    6. 6.6  I2C0 and I2C1 Interface Timing Requirements
    7. 6.7  Port 1 Input Pixel Interface Timing Requirements
    8. 6.8  Port 2 Input Pixel Interface (FPD-Link Compatible LVDS Input) Timing Requirements
    9. 6.9  System Oscillator Timing Requirements
    10. 6.10 Reset Timing Requirements
    11. 6.11 Video Timing Input Blanking Specification
      1. 6.11.1 Source Input Blanking
    12. 6.12 Programmable Output Clocks Switching Characteristics
    13. 6.13 DMD Interface Switching Characteristics
    14. 6.14 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Power Consumption
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Board Level Test Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 Structured Light Applications
      2. 8.4.2 (LVDS) Receiver Supported Pixel Mapping Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Chipset Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 DLPC350 System Interfaces
            1. 9.2.1.2.1.1 Control Interface
            2. 9.2.1.2.1.2 Input Data Interface
          2. 9.2.1.2.2 DLPC350 System Output Interfaces
            1. 9.2.1.2.2.1 Illumination Interface
            2. 9.2.1.2.2.2 Trigger Interface (Sync Outputs)
          3. 9.2.1.2.3 DLPC350 System Support Interfaces
            1. 9.2.1.2.3.1 Reference Clock
            2. 9.2.1.2.3.2 PLL
            3. 9.2.1.2.3.3 Program Memory Flash Interface
          4. 9.2.1.2.4 DMD Interfaces
            1. 9.2.1.2.4.1 DLPC350 to DMD Digital Data
            2. 9.2.1.2.4.2 DLPC350 to DMD Control Interface
            3. 9.2.1.2.4.3 DLPC350 to DMD Micromirror Reset Control Interface
  10. 10Power Supply Recommendations
    1. 10.1 System Power and Reset
      1. 10.1.1 Default Conditions
        1. 10.1.1.1 1.2-V System Power
        2. 10.1.1.2 1.8-V System Power
        3. 10.1.1.3 1.9-V System Power
        4. 10.1.1.4 3.3-V System Power
        5. 10.1.1.5 FPD-Link Input LVDS System Power
      2. 10.1.2 System Power-up and Power-down Sequence
      3. 10.1.3 Power-On Sense (POSENSE) Support
      4. 10.1.4 Power-Good (PWRGOOD) Support
      5. 10.1.5 5-V Tolerant Support
      6. 10.1.6 Power Reset Operation
      7. 10.1.7 System Reset Operation
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DMD Interface Design Considerations
      2. 11.1.2 DMD Termination Requirements
      3. 11.1.3 Decoupling Capacitors
      4. 11.1.4 Power Plane Recommendations
      5. 11.1.5 Signal Layer Recommendations
      6. 11.1.6 General Handling Guidelines for CMOS-Type Pins
      7. 11.1.7 PCB Manufacturing
        1. 11.1.7.1 General Guidelines
        2. 11.1.7.2 Trace Widths and Minimum Spacings
        3. 11.1.7.3 Routing Constraints
        4. 11.1.7.4 Fiducials
        5. 11.1.7.5 Flex Considerations
        6. 11.1.7.6 DLPC350 Thermal Considerations
    2. 11.2 Layout Example
      1. 11.2.1 Printed Circuit Board Layer Stackup Geometry
      2. 11.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
      3. 11.2.3 Recommended DLPC350 PLL Layout Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Video Timing Parameter Definitions
      2. 12.1.2 Device Nomenclature
      3. 12.1.3 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

9.2.1.2.1.2 Input Data Interface

The data interface has two components: a parallel RGB-input port and an FPD-Link LVDS input port. Both components can support up to 30 bits and have a nominal I/O voltage of 3.3 V. The Interface Timing Requirements in Specifications list the maximum and minimum input timing specifications for both components.

The parallel RGB port can support up to 30 bits in video mode. In pattern mode, the upper 8-bits of each color convert the 30-bit input into a 24-bit RGB input.

The FPD-Link input port can be configured to connect to a video decoder device or an external processor through a 24-, 27-, or 30-bit interface.

Table 11 provides a description of the signals associated with the data interface.

Table 11. Active Signals – Data Interface

Signal Name Description
RGB Parallel Interface
P1_(A, B, C)_[0:9] 30-bit data inputs 10 bits for each of the red, green, and blue channels). If interfacing to a system with less than 10-bits per color, connect the bus of the red, green, and blue channels to the upper bits of the DLPC350 10-bit bus.
P1A_CLK Pixel clock; all input signals on data interface are synchronized with this clock.
P1_VSYNC Vertical sync
P1_HSYNC Horizontal sync
P1_DATAEN Input data valid
FPD-Link LVDS Input
RCK Differential input signal for clock
RA_IN Differential input signal for data channel A
RB_IN Differential input signal for data channel B
RC_IN Differential input signal for data channel C
RD_IN Differential input signal for data channel D
RE_IN Differential input signal for data channel E

The A, B, and C input data channels of Port 1 can be internally swapped for optimum board layout.